The **ATS-15D-52-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **blueICE™** series and is designed for high-density electronic cooling. --- ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Anodized Blue) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 35mm x 35mm x 25mm | | **Thermal Resistance** | 10.79°C/W (at 100 LFM) | | **Fin Pattern** | Fine Pitch (Straight Fin) | | **Weight** | ~40 grams | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the physical and thermal characteristics: * **ATS-15**: The series identifier (Advanced Thermal Solutions). * **D**: Designates the specific attachment type or hole pattern. * **52**: Represents the specific fin geometry and thermal profile. * **C2**: Indicates the material/finish (Aluminum with Blue Anodized finish). * **R0**: Refers to the revision code or packaging standard. --- ### 3. Key Electronic Cooling Features #### A. pushPIN™ Attachment Unlike adhesive tapes or simple clips, this model uses a **pushPIN™ system**. This provides: * **Consistent Pressure:** Ensures optimal contact between the heat sink and the electronic component (CPU/GPU/FPGA). * **Reliability:** Resistant to vibration and shock, making it suitable for industrial or aerospace applications. #### B. Thermal Interface Material (TIM) The "C2" variant typically comes pre-applied with a high-performance thermal interface material. This fills microscopic air gaps between the heat sink and the chip, significantly reducing thermal resistance. #### C. Airflow Optimization The straight-fin design is optimized for **forced convection** (active cooling with fans). It allows air to pass through the fins with minimal pressure drop, which is critical for maintaining low operating temperatures in dense PCB layouts. --- ### 4. Common Applications * **Computing:** Cooling of Southbridge/Northbridge chipsets. * **Networking:** High-speed routers and switches. * **Power Electronics:** Voltage regulators and power modules. * **Industrial:** Embedded systems requiring passive or active cooling in harsh environments.