The **ATS-15D-53-C2-R0** is a high-performance electronic thermal management component manufactured by **Advanced Thermal Solutions (ATS)**. Specifically, it belongs to the **Blue Ice™** series of heat sinks, designed for cooling electronic components such as CPUs, GPUs, and power modules. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part number: | Attribute | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 30.00mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 2.32°C/W (at 200 LFM) | | **Weight** | ~40 grams | --- ### 2. Breakdown of the Part Number The part number is structured to define every physical aspect of the heat sink: 1. **ATS-15D**: Refers to the series and base plate design. 2. **53**: Indicates the specific size and fin configuration. 3. **C2**: Denotes the **Blue Anodized** finish. 4. **R0**: Indicates the revision number and RoHS compliance status. --- ### 3. Key Electronic Components & Features #### A. pushPIN™ Attachment System This part uses a specialized **pushPIN™** system for mounting. - **Benefit:** It ensures even pressure distribution (TIM - Thermal Interface Material compression) across the component being cooled, which is critical for preventing hot spots. - **Components:** Includes a brass or plastic pin and a compression spring. #### B. Thermal Interface Material (TIM) The "R0" version usually comes pre-applied with a high-performance thermal pad or grease. This fills the microscopic air gaps between the electronic component (die/package) and the aluminum base of the heat sink. #### C. Straight Fin Design The fins are oriented in a straight pattern. This is optimized for **forced convection** (active airflow from a fan), allowing air to pass through the channels with minimal pressure drop. --- ### 4. Common Applications * **High-speed Networking:** Switches and routers. * **Embedded Computing:** Industrial PC processors. * **Power Supplies:** Cooling MOSFETs or voltage regulators. * **LED Systems:** Managing heat in high-output arrays.