The **ATS-15D-55-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number itself follows a specific nomenclature used by ATS to define the physical and thermal properties of the component. | Property | Value / Description | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Attachment Method** | Push-Pin (with Compression Springs) | | **Dimensions (L x W)** | 35mm x 35mm | | **Height (H)** | 10mm (Low Profile) | | **Finish** | Blue Anodized | | **Thermal Resistance** | ~24.00°C/W (Unducted @ 100 LFM) | --- ### 2. Physical Design Features #### **A. Fin Profile (Cross-Cut)** This heatsink features a **cross-cut** design. Unlike standard straight-fin heatsinks, cross-cut fins allow for multi-directional airflow. This is critical in cramped electronic enclosures where the direction of the system fan's airflow might be inconsistent or obstructed. #### **B. Push-Pin Attachment** The "R0" designation refers to the attachment mechanism. This model uses a push-pin and spring assembly: * **Security:** Provides high-pressure contact between the heatsink and the component. * **Thermal Interface:** It is typically pre-assembled with **Phase Change Material (PCM)** or high-performance thermal tape (T766) to ensure maximum heat transfer from the chip to the aluminum. --- ### 3. Electronic Application This part is commonly used in the following electronic environments: 1. **Telecommunications:** Cooling network switches and routers. 2. **Embedded Systems:** Protecting SoCs (System on Chips) in industrial automation. 3. **Power Electronics:** Managing heat for high-voltage regulators. 4. **PCBs:** Ideal for boards with 3.2mm or 4.7mm holes for push-pin mounting. --- ### 4. Thermal Performance Table Thermal resistance indicates how effectively the unit cools. Lower values are better at higher airflows. | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 24.00 | | 300 | 1.5 | 7.20 | | 500 | 2.5 | 4.60 | | 700 | 3.5 | 3.50 |