The **ATS-15D-56-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to provide high cooling efficiency in constrained airflow environments. --- ## 1. Technical Specifications Below is a breakdown of the core technical parameters for this part: | Parameter | Specification | Details | | :--- | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions | ATS | | **Thermal Resistance** | 3.05°C/W (@ 200 LFM) | Lower is better for heat dissipation | | **Material** | Aluminum | Lightweight with high conductivity | | **Finish** | Blue Anodized | Protects against corrosion and enhances radiation | | **Attachment Method** | pushPIN™ | Uses a spring-loaded pin mechanism | | **Dimensions** | 37.00mm x 37.00mm | Footprint size | | **Height** | 15.00mm | Profile height | --- ## 2. Key Design Features ### A. maxiFLOW™ Fin Geometry Unlike standard straight-fin heatsinks, the **maxiFLOW** design features a "flared" fin structure. This increases the surface area and creates more turbulence in the airflow, which significantly improves the convection heat transfer coefficient without requiring a massive increase in physical size. ### B. pushPIN™ Attachment System The "R0" suffix indicates the use of the **pushPIN™** assembly. This system includes: * **Compression Springs:** Ensure even pressure across the component (TIM - Thermal Interface Material) for maximum contact. * **Flexible Mounting:** Designed with pre-drilled holes in the PCB to provide a secure, vibration-resistant fit. ### C. Material Composition The part is made of **6063 Aluminum Alloy**, which offers a balance between thermal conductivity and structural rigidity. The **Blue Anodized** finish is not just aesthetic; it provides a high-emissivity surface that aids in radiative cooling. --- ## 3. Application Use Cases This specific heatsink is typically used for cooling medium-power electronic components, including: * **ASICs and FPGAs:** High-speed processing units that generate localized heat. * **Northbridge/Southbridge:** Motherboard chipsets. * **Network Switches:** Cooling for high-density telecommunications equipment. --- ## 4. Performance Data (Example Airflow) Thermal performance varies based on the velocity of air (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 3.05 | | 400 (2.0 m/s) | 1.71 | | 600 (3.0 m/s) | 1.15 | ---