The **ATS-15D-62-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. It is manufactured by *Advanced Thermal Solutions, Inc.* --- ### 1. Technical Specifications Below is a breakdown of the physical and thermal properties of this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-15D-62-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 40mm x 40mm x 15mm | | **Thermal Resistance** | 16.48°C/W (at 100 LFM) | | **Flow Direction** | Vertical / Omni-Directional | --- ### 2. Key Design Features * **pushPIN™ Attachment:** This model uses a specialized push-pin system with a brass/plastic pin and a compression spring. This ensures consistent pressure across the component for maximum heat transfer. * **High-Performance Fin Design:** The "62" series typically refers to a specific fin density and pattern optimized for both natural and forced convection cooling. * **Pre-Applied Thermal Interface Material (TIM):** Most "C2" versions come with a high-performance thermal pad or grease pre-applied to the base, reducing assembly time. * **Blue Anodized Coating:** This is not just for aesthetics; the anodization increases surface emissivity, slightly improving radiation cooling and protecting the aluminum from corrosion. --- ### 3. Part Number Decoder Understanding the "ATS-15D-62-C2-R0" nomenclature: 1. **ATS-15D**: Identifies the base product series and physical footprint. 2. **62**: Refers to the specific fin height and configuration (15mm height in this case). 3. **C2**: Indicates the thermal interface material (TIM) type and the Blue Anodized finish. 4. **R0**: Refers to the revision and packaging standard. --- ### 4. Applications This heatsink is commonly used in: * **Network Switches/Routers:** Cooling high-speed processors. * **Embedded Systems:** For industrial PCs where space is limited. * **Power Electronics:** Managing heat in MOSFETs or Voltage Regulators.