The **ATS-15D-63-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) such as CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Property | Specification | | :--- | :--- | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-pin (Spring-loaded) | | **Thermal Resistance** | 2.85°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 40mm x 40mm x 20mm | | **Fin Pattern** | Cross-Cut | --- ### 2. Physical Design Features The construction of this heat sink is optimized for specific airflow environments: * **Cross-Cut Fin Pattern:** Unlike straight fins, the cross-cut design allows for airflow from any direction (omnidirectional). This is ideal for crowded PCBs where airflow might be turbulent or unpredictable. * **Push-Pin Mounting:** It uses a brass or plastic push-pin with a stainless steel spring. This provides a precise "clamping force" to ensure the heat sink makes firm contact with the chip, improving thermal transfer. * **C2 Material Grade:** Indicates the use of an **Aluminum 6063** alloy, which provides an excellent balance between structural strength and high thermal conductivity. --- ### 3. Electronic Application This part is generally used in high-power electronic systems to prevent thermal throttling or hardware failure. * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T766** phase-change material or a high-performance thermal pad, reducing the need for manual thermal paste application. * **Target Components:** It is sized perfectly for standard 40mm BGA (Ball Grid Array) packages used in networking switches, industrial controllers, and telecommunications hardware. --- ### 4. Part Number Breakdown (Nomenclature) Understanding the code helps in selecting the right variant: | Segment | Meaning | | :--- | :--- | | **ATS-15** | Advanced Thermal Solutions - pushPIN™ Series | | **D** | Material/Attachment Configuration | | **63** | Design ID / Dimensions Reference | | **C2** | Thermal Interface Material (TIM) and Finish Type | | **R0** | Revision / Packaging Code |