The **ATS-15D-70-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **blueICE™** series and is designed for high-density electronic cooling applications. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Heat Sink Type** | pushPIN™ HS Assembly | | **Thermal Resistance** | 8.70°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W)** | 45.00 mm x 45.00 mm | | **Height** | 25.00 mm | | **Pitch** | Fine Pitch (straight fin) | --- ### 2. Key Electronic Features #### A. Thermal Interface Material (TIM) The "R0" suffix indicates the type of Thermal Interface Material pre-applied to the base. * **Material:** T766 (High-performance phase change material). * **Function:** Fills microscopic air gaps between the semiconductor (CPU, GPU, or FPGA) and the heat sink base to maximize heat transfer. #### B. pushPIN™ Attachment System Unlike adhesive tapes or simple clips, this model uses a specialized mechanical fastening system: * **Components:** Brass or plastic pins and stainless steel springs. * **Benefit:** Provides a precise, repeatable pressure (Force) across the electronic component, ensuring optimal thermal contact without damaging the PCB. #### C. Aerodynamic Fin Design The part uses a **Straight-Fin** pattern. This is optimized for: * **Directional Airflow:** Best used when there is a specific fan path in the electronic enclosure. * **Low Pressure Drop:** Allows air to pass through with minimal resistance, reducing the load on system fans. --- ### 3. Applications This part is commonly found in the following electronic sectors: * **Telecommunications:** Cooling high-speed networking switches. * **Computing:** Embedded processors and power modules. * **Industrial:** Motor controllers and power supplies where space is limited but heat generation is high. ---