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  • ATS-15D-75-C1-R0

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    The **ATS-15D-75-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions Inc.* It belongs to the **pushPIN™** series, designed for efficient cooling of semiconductor components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Part Number** | ATS-15D-75-C1-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 1.47°C/W @ 100 LFM (Linear Feet per Minute) | | **Dimensions** | 25mm x 25mm x 30mm | --- ### 2. Design and Construction The component is engineered with several key structural features to maximize heat dissipation: * **Fin Style:** It features a **Straight Fin** design. This allows for low pressure drop and is ideal for systems with a defined airflow direction. * **Thermal Interface Material (TIM):** The "C1" in the part number indicates it comes with a high-performance **T766 phase change material** or equivalent thermal pad pre-applied to the base, ensuring minimal air gaps between the chip and the metal. * **PushPIN™ Mechanism:** This replaces traditional adhesive tapes. It uses a flexible attachment system with a "catch" and a compression spring to provide precise pressure, ensuring optimal contact with the heat source. --- ### 3. Thermal Performance Analysis The performance of the ATS-15D-75-C1-R0 varies based on the airflow (velocity) within the electronic enclosure: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 1.47 | | 200 (1.0 m/s) | 0.93 | | 300 (1.5 m/s) | 0.77 | | 400 (2.0 m/s) | 0.68 | --- ### 4. Key Electronic Applications Because of its high height-to-width ratio (30mm height on a 25mm base), this part is typically used in: * **Network Switches/Routers:** Where vertical space is available but PCB real estate is limited. * **Power Supplies:** To cool MOSFETs or voltage regulators. * **Embedded Systems:** Industrial PCs requiring passive or semi-active cooling.
    ✨ Follow-up Questions
    • ⤷ What is the difference between blue anodized and black anodized finishes for this part?
    • ⤷ How do I calculate if the 1.47°C/W resistance is sufficient for my specific chip?
    • ⤷ Can the pushPIN attachment be reused if I need to replace the chip?