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  • ATS-15D-86-C2-R0

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    ## Overview of ATS-15D-86-C2-R0 The **ATS-15D-86-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is specifically part of the **blueICE™** series, designed for cooling electronic components such as CPUs, GPUs, FPGAs, and ASICs where space is limited but thermal demands are high. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 3.10°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 15.00mm | | **Base Shape** | Square | | **Fin Style** | Straight (High-density) | --- ### 2. Component Analysis #### A. The pushPIN™ Attachment System Unlike adhesive-based heat sinks, this model uses a **pushPIN™** system. * **Structure:** It consists of a plastic or brass pin and a stainless steel spring. * **Benefit:** Provides consistent pressure (clamping force) against the component, which optimizes the thermal interface material (TIM) performance and ensures the heat sink remains secure during vibration or shipping. #### B. Thermal Performance The "86" in the part number refers to a specific fin configuration designed for maximum surface area. * **Low Flow Performance:** Even at low airflow (200 LFM), it maintains a thermal resistance of roughly **3.10°C/W**. * **High Flow Performance:** As airflow increases to 700 LFM, the resistance drops significantly (approx. **1.30°C/W**), making it highly efficient for forced-air cooling environments. #### C. Material and Coating * **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodization:** Not just for aesthetics; the anodized layer provides corrosion resistance and increases surface emissivity, which slightly improves radiant heat transfer. --- ### 3. Typical Applications This specific part is often found in: 1. **Telecommunications:** High-speed routers and switches. 2. **Embedded Systems:** Industrial PCs where vertical clearance (15mm) is restricted. 3. **Power Electronics:** Cooling MOSFETs or power conversion modules. --- ### 4. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Manufacturer) | | **15D** | pushPIN™ Series | | **86** | Fin Pattern / Pitch Configuration | | **C2** | Material/Finish (Aluminum / Blue Anodized) | | **R0** | Packaging/Revision Code |
    ✨ Follow-up Questions
    • ⤷ What is the hole-to-hole spacing required on the PCB for the pushPIN attachment?
    • ⤷ How does the C2 anodized finish compare to a nickel-plated finish in terms of thermal performance?
    • ⤷ What type of Thermal Interface Material (TIM) is pre-applied to this heat sink?