ATS-15D-86-C2-R0
AI

## Overview of ATS-15D-86-C2-R0
The **ATS-15D-86-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is specifically part of the **blueICE™** series, designed for cooling electronic components such as CPUs, GPUs, FPGAs, and ASICs where space is limited but thermal demands are high.
---
### 1. Key Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | 3.10°C/W (at 200 LFM) |
| **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 15.00mm |
| **Base Shape** | Square |
| **Fin Style** | Straight (High-density) |
---
### 2. Component Analysis
#### A. The pushPIN™ Attachment System
Unlike adhesive-based heat sinks, this model uses a **pushPIN™** system.
* **Structure:** It consists of a plastic or brass pin and a stainless steel spring.
* **Benefit:** Provides consistent pressure (clamping force) against the component, which optimizes the thermal interface material (TIM) performance and ensures the heat sink remains secure during vibration or shipping.
#### B. Thermal Performance
The "86" in the part number refers to a specific fin configuration designed for maximum surface area.
* **Low Flow Performance:** Even at low airflow (200 LFM), it maintains a thermal resistance of roughly **3.10°C/W**.
* **High Flow Performance:** As airflow increases to 700 LFM, the resistance drops significantly (approx. **1.30°C/W**), making it highly efficient for forced-air cooling environments.
#### C. Material and Coating
* **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties.
* **Blue Anodization:** Not just for aesthetics; the anodized layer provides corrosion resistance and increases surface emissivity, which slightly improves radiant heat transfer.
---
### 3. Typical Applications
This specific part is often found in:
1. **Telecommunications:** High-speed routers and switches.
2. **Embedded Systems:** Industrial PCs where vertical clearance (15mm) is restricted.
3. **Power Electronics:** Cooling MOSFETs or power conversion modules.
---
### 4. Part Number Breakdown
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Advanced Thermal Solutions (Manufacturer) |
| **15D** | pushPIN™ Series |
| **86** | Fin Pattern / Pitch Configuration |
| **C2** | Material/Finish (Aluminum / Blue Anodized) |
| **R0** | Packaging/Revision Code |
- ⤷
What is the hole-to-hole spacing required on the PCB for the pushPIN attachment?
- ⤷ How does the C2 anodized finish compare to a nickel-plated finish in terms of thermal performance?
- ⤷ What type of Thermal Interface Material (TIM) is pre-applied to this heat sink?