### ATS-15D-87-C2-R0: Technical Overview The **ATS-15D-87-C2-R0** is a high-performance **Heat Sink** assembly designed by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, specifically engineered for cooling electronic components such as processors, FPGAs, and ASICs where space is limited and thermal performance is critical. --- ### 1. Key Technical Specifications | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-15D-87-C2-R0 | | **Material** | Aluminum (Body) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Thermal Resistance (Flowing)** | 2.72°C/W @ 100 LFM | | **Thermal Resistance (Static)** | 14.77°C/W (Duct-free) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 12.70mm | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Component Design Features #### A. The maxiFLOW™ Geometry The heat sink features a unique **flared fin structure**. Unlike standard straight-fin heat sinks, this design increases the surface area and creates turbulence in the airflow, which significantly enhances heat dissipation in low-airflow environments. #### B. pushPIN™ Attachment System The "R0" designation refers to the attachment mechanism. It uses a **pushPIN™** system characterized by: * **Brass Springs:** Provides a precise and consistent pressure (load) on the component. * **Plastic/Brass Pins:** Securely locks the heat sink into pre-drilled holes on the PCB. * **Vibration Resistance:** Ideal for industrial or automotive environments where mechanical stability is required. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. This is a high-performance phase-change or grease-like material designed to fill the microscopic air gaps between the component die and the heat sink base, ensuring maximum thermal conductivity. --- ### 3. Thermal Performance Comparison Performance varies based on the velocity of the air (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 2.72 | | 200 (1.0 m/s) | 2.02 | | 400 (2.0 m/s) | 1.51 | | 600 (3.0 m/s) | 1.29 | --- ### 4. Applications * **Network Switches/Routers:** Cooling high-speed data processing chips. * **Power Supplies:** Managing heat in compact DC-DC converters. * **Embedded Systems:** Protecting CPUs in fanless or restricted-airflow enclosures. ---