## Overview: ATS-15D-95-C2-R0 The **ATS-15D-95-C2-R0** is a specific high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **blueICE™** series, designed primarily for cooling electronic components such as processors, FPGAs, and ASICs where space is limited but thermal demands are high. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ Heat Sink Assembly | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimensions (L x W x H)** | 40mm x 40mm x 25mm | | **Thermal Resistance** | 7.29°C/W (Unducted Flow @ 100 LFM) | | **Fin Configuration** | Fine Pitch (Rectangular) | --- ### Core Electronic & Mechanical Components The assembly is composed of four primary elements that work together to manage the thermodynamics of an electronic circuit: #### 1. The Heat Sink Body * **Material:** Extruded Aluminum. Aluminum is used for its high thermal conductivity and lightweight properties. * **Fin Design:** The "Fine Pitch" design maximizes the surface area available for heat dissipation. This allows for efficient cooling even in systems with low airflow. #### 2. The pushPIN™ Attachment System Unlike adhesive-based heat sinks, this model uses a mechanical fastening system: * **Pins:** Nylon or Brass pins that snap into pre-drilled holes on the PCB. * **Springs:** Compression springs provide a precise "Force-to-Fit," ensuring consistent pressure between the heat sink and the component. This prevents the heat sink from shifting during vibration or shipping. #### 3. Thermal Interface Material (TIM) * The **C2** in the part number indicates the specific thermal interface material. * It typically comes pre-applied with **T766** or a similar high-performance thermal grease to ensure there are no air gaps between the electronic component and the aluminum base. #### 4. Hardware Finish * **Blue Anodized:** This is an electrochemical process that increases corrosion and wear resistance. It also provides a slight increase in surface emissivity, aiding in radiant heat loss. --- ### Performance Data (Thermal Resistance) Thermal resistance measures how effectively the part moves heat away from the chip. Lower values are better. | Velocity (LFM) | 100 (0.5m/s) | 300 (1.5m/s) | 500 (2.5m/s) | | :--- | :--- | :--- | :--- | | **Unducted Flow** | 7.29 °C/W | 2.48 °C/W | 1.45 °C/W | | **Ducted Flow** | 1.75 °C/W | 1.10 °C/W | 0.90 °C/W | --- ### Application Summary This part is commonly found in: * **Networking Equipment:** Routers and switches. * **Industrial PCs:** Compact computing modules. * **Power Supplies:** High-density power conversion units.