The **ATS-15E-75-C3-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Push-Pin Heat Sink**. It is designed to cool electronic components like CPUs, GPUs, or FPGAs by dissipating heat into the surrounding air. --- ## Technical Specifications The following table outlines the physical and thermal characteristics of this specific part number: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-15E-75-C3-R0 | | **Heat Sink Type** | Push-Pin (straight fin design) | | **Material** | Aluminum (Blue Anodized) | | **Thermal Resistance** | 1.51°C/W (@ 200 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 30mm | | **Attachment Method** | Plastic Push-Pin with Brass Springs | | **Thermal Interface Material** | T412 (Pre-applied) | --- ## Breakdown of Key Components ### 1. The Heat Sink Body * **Fin Profile:** This model typically features a **straight-fin** or **cross-cut** design, providing a large surface area for heat exchange. * **Material:** Made from **6063 Aluminum**, which offers a high thermal conductivity-to-weight ratio. The **Blue Anodized** finish protects the aluminum from corrosion and slightly increases emissivity. ### 2. The Attachment Mechanism (Push-Pins) * **Structure:** This part uses a specialized push-pin system consisting of a flexible plastic pin and a high-tension brass spring. * **Benefit:** It ensures consistent pressure on the component (IC), which is critical for maximizing thermal transfer. The hole pattern required for this specific model is usually **38mm x 38mm**. ### 3. Thermal Interface Material (TIM) * **Type:** It comes pre-applied with **T412**, a high-performance thermal tape. * **Function:** It fills the microscopic air gaps between the component surface and the heat sink base, significantly reducing thermal resistance. --- ## Performance Summary The efficiency of the ATS-15E-75-C3-R0 depends heavily on the airflow (measured in Linear Feet per Minute - LFM). * **Low Airflow (200 LFM):** ~1.51°C/W thermal resistance. * **High Airflow (800 LFM):** ~0.70°C/W thermal resistance. --- ## Use Case Applications * **Networking Equipment:** Switches, routers, and high-speed modems. * **Industrial PCs:** Cooling embedded processors in fanless or forced-air environments. * **Power Supplies:** Heat dissipation for MOSFETs and power regulators.