The **ATS-15F-05-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** series, which is specifically designed to provide low thermal resistance and high reliability for cooling electronic components. --- ## 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 36.83mm x 41.21mm x 22.86mm | | **Thermal Resistance** | 3.52° C/W @ 200 LFM | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Interface Material** | T766 (Thermal Interface Material pre-applied) | | **Airflow Direction** | Directional (High-performance fin geometry) | --- ## 2. Key Features and Design ### Fin Geometry The "F" in the part number denotes the **maxiFLOW™** design. This utilizes a tapered fin structure that increases surface area and creates turbulence, which enhances heat dissipation compared to traditional straight-fin heat sinks. ### Attachment Mechanism (pushPIN™) The **-R0** suffix indicates a standard push-pin assembly. * **Ease of Install:** Uses a flexible plastic or metal pin that snaps into pre-drilled holes on the PCB. * **Consistent Pressure:** Includes a compression spring to ensure even contact pressure between the heat sink and the component, maximizing thermal transfer. ### Surface Treatment The **Blue Anodized** finish is not just for aesthetics; it provides: * Increased corrosion resistance. * Enhanced surface emissivity, slightly improving radiation cooling. * Electrical insulation of the surface. --- ## 3. Typical Applications This specific size and thermal profile are commonly used for: * **CPUs/GPUs:** Small form factor processors or mobile chips. * **FPGAs & ASICs:** High-heat integrated circuits in networking equipment. * **Power Supplies:** Cooling transistors or voltage regulators in dense PCB layouts. --- ## 4. Thermal Performance Data Performance varies based on the velocity of airflow (LFM - Linear Feet per Minute): | Airflow (LFM) | Thermal Resistance (°C/W) | Pressure Drop (in. H2O) | | :--- | :--- | :--- | | 200 | 3.52 | 0.16 | | 400 | 2.50 | 0.32 | | 600 | 2.05 | 0.45 |