The **ATS-15F-06-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Thermal Resistance** | 20.17 °C/W (Unducted Flow @ 100 LFM) | | **Dimensions** | 45mm x 45mm x 10mm | | **Weight** | 30 grams (Approx.) | --- ### 2. Key Design Elements #### A. Fin Profile (Fine Pitch) The "06" in the part number indicates a specific fin pattern. These heat sinks typically utilize a **straight-fin or cross-cut** design to maximize surface area. This allows for better heat exchange with the surrounding air, especially in forced convection (fan-cooled) environments. #### B. Push-Pin Attachment Instead of using messy thermal adhesives or complex screws, this part uses a **spring-loaded push-pin** mechanism: - **Consistent Pressure:** The springs ensure a uniform downward force on the component. - **Easy Installation:** It requires pre-drilled holes in the PCB (usually 3.0mm diameter). - **Serviceability:** The sink can be removed and reapplied without damaging the motherboard. #### C. Thermal Interface Material (TIM) The "C2" suffix typically denotes the pre-applied thermal interface material. - It usually comes with **T766** or a similar high-performance thermal phase-change material. - This fills the microscopic air gaps between the component and the heat sink base to lower thermal resistance. --- ### 3. Application Use Cases This specific low-profile (10mm height) heat sink is ideal for: 1. **Network Switches/Routers:** Where vertical space is limited. 2. **Embedded Systems:** Industrial PCs requiring rugged mechanical mounting. 3. **Power Electronics:** Cooling MOSFETs or voltage regulators. ---