The **ATS-15F-07-C3-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. Below is a detailed breakdown of its specifications and physical attributes. --- ### 1. Technical Specifications This part is manufactured by **Advanced Thermal Solutions (ATS)** as part of their "push pin" series. | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-15F-07-C3-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (with Springs) | | **Thermal Resistance** | 17.09 °C/W (at 100 LFM) | | **Flow Direction** | Vertical (Cross-Cut for omni-directional airflow) | --- ### 2. Physical Dimensions The dimensions are critical for determining if the heatsink fits on a specific PCB layout. | Dimension | Measurement | | :--- | :--- | | **Length/Width** | 45.00 mm x 45.00 mm | | **Height** | 12.70 mm | | **Pin Pitch (Spacing)** | 38.00 mm | | **Weight** | ~15 grams | --- ### 3. Key Component Features * **Push-Pin Mounting:** Unlike adhesive-based heatsinks, this uses a mechanical push-pin system. This provides more consistent pressure and is more reliable in high-vibration environments. * **Cross-Cut Fin Design:** The fins are cut in a grid pattern. This allows air to flow through the heatsink from any direction (omni-directional), making it ideal for systems where the airflow direction is unpredictable. * **Pre-Applied Thermal Interface Material (TIM):** This specific model typically comes with **T412** thermal tape or phase-change material pre-applied to the base to ensure efficient heat transfer from the chip to the aluminum. * **C3 Material Grade:** The "C3" in the part number indicates the specific thermal performance and material classification within the ATS product line (often referring to the high-efficiency aluminum alloy used). ### 4. Common Applications * **CPUs/GPUs:** Cooling secondary processors or graphics chips. * **FPGAs:** Cooling large programmable logic devices. * **Telecommunications:** Used in routers and switches where components are packed tightly together. * **Power Supplies:** Dissipating heat from power transistors. ---