ATS-15F-08-C3-R0
AI

The **ATS-15F-08-C3-R0** is a specific electronic component belonging to the **Heat Sink** category, manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" series, designed for high-performance cooling of integrated circuits (ICs) and other electronic components.
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### 1. Technical Specifications
Below are the primary technical parameters for this component:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Type** | Top Mount (Heat Sink) |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push Pin (Plastic) |
| **Spring Type** | Brass |
| **Dimensions** | 45.00mm x 45.00mm |
| **Height (Fin)** | 17.50mm |
| **Thermal Resistance** | 14.60°C/W (Unducted @ 100 LFM) |
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### 2. Physical Design Features
The component is engineered with specific geometries to maximize heat dissipation in constrained spaces:
* **Fin Configuration:** It utilizes a **Square Fin** pattern. This cross-cut design allows for airflow from multiple directions, making it ideal for systems where the air path is not strictly linear.
* **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T412** thermal tape or grease, which ensures efficient heat transfer between the chip surface and the aluminum base.
* **Push-Pin Attachment:** The "R0" suffix indicates a specific kit that includes plastic push pins and springs. This mechanism provides consistent pressure (load) on the processor, which is critical for maintaining thermal contact without cracking the silicon die.
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### 3. Thermal Performance (Airflow)
Thermal resistance varies based on the velocity of the air moving through the fins:
| Air Velocity (LFM) | 100 (0.5m/s) | 300 (1.5m/s) | 500 (2.5m/s) |
| :--- | :--- | :--- | :--- |
| **Unducted Flow (°C/W)** | 14.60 | 5.30 | 3.40 |
| **Ducted Flow (°C/W)** | 4.00 | 2.50 | 2.10 |
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### 4. Part Number Breakdown
Understanding the nomenclature helps in identifying variations:
* **ATS:** Advanced Thermal Solutions (Manufacturer).
* **15F:** Series/Family designator.
* **08:** Dimensional code (relates to height and fin density).
* **C3:** Material/Finish code (Blue Anodized).
* **R0:** Revision/Packaging code (includes mounting hardware).
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What are the compatible PCB hole patterns for the ATS-15F-08-C3-R0?
- ⤷ How does the T412 thermal interface material compare to high-performance thermal paste?
- ⤷ Are there low-profile versions of this heat sink for 1U server applications?