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  • ATS-15F-08-C3-R0

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    The **ATS-15F-08-C3-R0** is a specific electronic component belonging to the **Heat Sink** category, manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" series, designed for high-performance cooling of integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications Below are the primary technical parameters for this component: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Type** | Top Mount (Heat Sink) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Plastic) | | **Spring Type** | Brass | | **Dimensions** | 45.00mm x 45.00mm | | **Height (Fin)** | 17.50mm | | **Thermal Resistance** | 14.60°C/W (Unducted @ 100 LFM) | --- ### 2. Physical Design Features The component is engineered with specific geometries to maximize heat dissipation in constrained spaces: * **Fin Configuration:** It utilizes a **Square Fin** pattern. This cross-cut design allows for airflow from multiple directions, making it ideal for systems where the air path is not strictly linear. * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T412** thermal tape or grease, which ensures efficient heat transfer between the chip surface and the aluminum base. * **Push-Pin Attachment:** The "R0" suffix indicates a specific kit that includes plastic push pins and springs. This mechanism provides consistent pressure (load) on the processor, which is critical for maintaining thermal contact without cracking the silicon die. --- ### 3. Thermal Performance (Airflow) Thermal resistance varies based on the velocity of the air moving through the fins: | Air Velocity (LFM) | 100 (0.5m/s) | 300 (1.5m/s) | 500 (2.5m/s) | | :--- | :--- | :--- | :--- | | **Unducted Flow (°C/W)** | 14.60 | 5.30 | 3.40 | | **Ducted Flow (°C/W)** | 4.00 | 2.50 | 2.10 | --- ### 4. Part Number Breakdown Understanding the nomenclature helps in identifying variations: * **ATS:** Advanced Thermal Solutions (Manufacturer). * **15F:** Series/Family designator. * **08:** Dimensional code (relates to height and fin density). * **C3:** Material/Finish code (Blue Anodized). * **R0:** Revision/Packaging code (includes mounting hardware).
    ✨ Follow-up Questions
    • ⤷ What are the compatible PCB hole patterns for the ATS-15F-08-C3-R0?
    • ⤷ How does the T412 thermal interface material compare to high-performance thermal paste?
    • ⤷ Are there low-profile versions of this heat sink for 1U server applications?