The **ATS-15F-100-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** series, designed specifically for cooling electronic components like CPUs, GPUs, and other integrated circuits. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Attachment Type** | Push-Pin (Spring-loaded) | | **Material** | Aluminum (Body), Brass (Pins) | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 25mm | | **Thermal Resistance** | 4.84 °C/W (Unducted Flow @ 100 LFM) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature that describes its physical and thermal characteristics: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **15F**: Series designation (specific fin pattern and design). * **100**: Length/Size reference (corresponds to the 45mm x 45mm footprint). * **C2**: Thermal interface material (usually indicates **T766** high-performance phase change material or grease). * **R0**: RoHS compliance and revision status. --- ### 3. Key Features and Components #### A. Fin Design (Cross-Cut) The unit features a **cross-cut** fin pattern. This design allows for multidirectional airflow, making it effective in systems where air might not be blowing in a single straight path. This increases the surface area for heat dissipation. #### B. pushPIN™ Attachment Mechanism Unlike adhesive tapes, this part uses a mechanical push-pin system: * **Springs:** Provide precise, uniform pressure across the component. * **Pins:** Designed to fit into pre-drilled holes on the PCB (printed circuit board). * **Reliability:** Mechanical mounting is more durable under high-vibration or high-heat environments compared to thermal tape. #### C. Blue Anodized Finish The surface is treated with a blue anodized coating. This is not just for aesthetics; it provides: * Corrosion resistance. * Improved emissivity for better radiative heat transfer. * Electrical insulation of the aluminum surface. --- ### 4. Application Use Cases This heat sink is typically used for components requiring mid-to-high thermal management, such as: * **Field Programmable Gate Arrays (FPGAs)** * **Application-Specific Integrated Circuits (ASICs)** * **Power supplies and converters** * **Embedded computing modules** ---