The **ATS-15F-101-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). --- ## 1. Technical Specifications The part belongs to the **pushPIN™** series, designed for easy and secure attachment to Printed Circuit Boards (PCBs). | Feature | Details | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Base Dimension** | 45mm x 45mm | | **Height (Fin)** | 30mm | | **Fin Pattern** | Straight | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Thermal Resistance** | 6.77°C/W (Unducted Flow @ 100 LFM) | | **RoHS Status** | Compliant | --- ## 2. Key Component Features ### A. Material and Finish * **Aluminum Construction:** Provides a lightweight but highly conductive path for heat to transfer from the component (CPU, GPU, or MOSFET) to the air. * **Blue Anodized Coating:** This is not just for aesthetics; the anodized finish increases surface emissivity and provides corrosion resistance. ### B. pushPIN™ Mounting System Instead of using messy adhesives or permanent solder, this part uses a **push-pin and brass spring mechanism**. This offers: 1. **Uniform Pressure:** Ensures the heat sink makes flat, consistent contact with the electronic component. 2. **Ease of Rework:** Allows the heat sink to be removed for maintenance or component replacement without damaging the PCB. ### C. Thermal Interface Material (TIM) * The **"C3"** in the part number typically indicates that it comes pre-applied with **T766 phase change material** or a high-performance thermal grease. This fills microscopic air gaps between the chip and the heat sink base. --- ## 3. Physical Dimensions The specific size of this unit is tailored for medium-to-large surface-mount components. ```text Length: 45.00 mm Width: 45.00 mm Height: 30.00 mm Pitch: 1.27 mm (Fin spacing) ``` --- ## 4. Typical Applications This electronic part is commonly found in: * **Telecommunications:** Cooling high-speed signal processors. * **Industrial Power Supplies:** Managing heat in voltage regulators. * **Embedded Computing:** Cooling SOCs (System on Chips) in fanless or forced-air environments. ---