The **ATS-15F-113-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the dimensions, fin style, and thermal properties. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Type** | Heat Sink (Top Mount) | | **Material** | Aluminum (AL6063) | | **Attachment Method** | Push-pin (Brass) | | **Thermal Resistance** | 11.79°C/W (Unducted Flow @ 100 LFM) | | **Base Dimensions** | 40.00mm x 40.00mm | | **Height** | 10.00mm | --- ### 2. Component Breakdown #### A. The Fin Design (Flat Fin) The "113" in the part number indicates a specific fin pattern. This model typically features a **high-density fin structure** designed to maximize surface area within a low-profile height (10mm). This is ideal for compact enclosures where vertical space is limited. #### B. The Material and Finish * **Aluminum 6063:** This alloy is chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodized:** The "C2" suffix indicates the finish. Blue anodizing provides corrosion resistance and increases thermal emissivity, helping slightly with radiative cooling. #### C. The Attachment Mechanism (Push-Pin) Unlike adhesive-based heat sinks, the **ATS-15F-113-C2-R0** uses a mechanical push-pin system: * **R0 Suffix:** Refers to the specific spring and pin kit included. * **Pressure:** The push-pin/spring combination ensures constant pressure between the heat sink and the chip, optimizing the Thermal Interface Material (TIM) performance. --- ### 3. Thermal Performance Profile Thermal resistance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 11.79 | | 300 (1.5 m/s) | 4.73 | | 500 (2.5 m/s) | 3.35 | | 700 (3.5 m/s) | 2.80 | --- ### 4. Typical Applications * **Embedded Systems:** Industrial PCs where space is tight. * **Telecommunications:** Network switches and routers. * **Power Supplies:** Cooling MOSFETs or Voltage Regulators. * **Consumer Electronics:** Set-top boxes or compact gaming consoles. ---