## Electronic Specifications and Details for ATS-15F-12-C2-R0 The **ATS-15F-12-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **blueICE™** series, designed for high-efficiency cooling of surface-mount components like CPUs, GPUs, and FPGAs. --- ### 1. Key Technical Specifications Below are the primary electronic and physical parameters for this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | blueICE™ | | **Thermal Resistance (LFM 200)** | 8.87 °C/W | | **Thermal Resistance (LFM 700)** | 2.50 °C/W | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Functional Components #### A. The Heat Sink Body * **Material:** Constructed from high-grade aluminum to ensure high thermal conductivity while maintaining low weight. * **Fin Design:** Uses a **straight fin** configuration. This is optimized for uni-directional airflow, allowing heat to dissipate rapidly as air passes through the channels. * **Anodization:** The blue anodized finish is not just aesthetic; it provides corrosion resistance and increases surface emissivity, slightly improving radiant heat transfer. #### B. The pushPIN™ Attachment System This part uses a specific mechanical attachment instead of adhesive: * **Mechanical Integrity:** It features a spring-loaded mechanism that ensures consistent pressure between the heat sink and the electronic component. * **Ease of Assembly:** Designed for quick installation on PCBs with pre-drilled holes, reducing the risk of component damage during mounting. #### C. Thermal Interface Material (TIM) * **T766:** This part comes with **T766 phase-change material** pre-applied to the base. * **Function:** It fills microscopic air gaps between the component (chip) and the heat sink base, significantly reducing contact thermal resistance. --- ### 3. Performance under Airflow Thermal resistance in electronic cooling is highly dependent on Linear Feet per Minute (LFM) of airflow: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 8.87 | | 400 (2.0 m/s) | 4.10 | | 600 (3.0 m/s) | 2.87 | | 800 (4.0 m/s) | 2.30 | --- ### 4. Dimensions and Fitment * **Width/Length:** 45mm x 45mm * **Height:** 12.7mm (Low profile, suitable for space-constrained enclosures) * **Pitch:** 1.0mm (standard for the blueICE™ series)