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  • ATS-15F-128-C2-R0

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    The **ATS-15F-128-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-15F-128-C2-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 2.91°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 25.00mm | | **Pin Type** | XC-CUT (Cross-Cut) | --- ### 2. Core Features * **pushPIN™ Attachment:** This model uses a proprietary push-pin system. It allows for quick, secure installation onto a PCB without the need for thermal adhesives or complex tools. * **XC-CUT Fin Design:** The "Cross-Cut" geometry provides a high surface area and allows for multi-directional airflow. This makes it ideal for dense PCB environments where airflow direction might be unpredictable. * **High Performance Thermal Interface Material (TIM):** This specific part number comes pre-applied with a high-performance thermal pad (usually T766), ensuring low thermal resistance between the component and the heat sink. * **Blue Anodized Finish:** The anodized coating not only provides a professional aesthetic but also adds a layer of corrosion resistance and slightly improves thermal radiation. --- ### 3. Application Use Cases The ATS-15F-128-C2-R0 is typically used in the following electronic systems: 1. **Networking Hardware:** High-speed routers and switches. 2. **Embedded Computing:** Industrial PC processors and chipsets. 3. **Power Supplies:** Heat dissipation for high-power transistors or MOSFETs. 4. **Telecom:** Base station equipment requiring high reliability in outdoor or cramped enclosures. --- ### 4. Comparison of Thermal Resistance (Airflow) | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 5.82 | | 300 | 1.5 | 2.10 | | 500 | 2.5 | 1.63 |
    ✨ Follow-up Questions
    • ⤷ How does the pushPIN™ attachment mechanism differ from standard clip-on heat sinks?
    • ⤷ What is the importance of the Blue Anodized finish for thermal performance?
    • ⤷ Can this heat sink be used for CPUs with a TDP higher than 50W?