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  • ATS-15F-13-C2-R0

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    The **ATS-15F-13-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to provide high efficiency in cooling electronic components like CPUs, FPGAs, and ASICs. --- ### ## Technical Specifications Below are the primary physical and thermal properties of this specific part number: | Property | Value / Description | | :--- | :--- | | **Part Number** | ATS-15F-13-C2-R0 | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (LxWxH)** | 50.0mm x 50.0mm x 12.7mm | | **Fin Style** | Tapered Fin (maxiFLOW™) | | **Attachment Method** | pushPIN™ (Pre-drilled holes) | | **Thermal Interface Material (TIM)** | T766 (High Performance) | | **Color** | Blue | --- ### ## Key Electronic & Thermal Features #### 1. maxiFLOW™ Fin Design The "maxiFLOW" geometry features a tapered fin design that increases the surface area while reducing pressure drop. In electronics, this allows for maximum heat dissipation even in environments with low-velocity airflow. #### 2. Thermal Resistance The efficiency of a heat sink is measured by its thermal resistance (lower is better). * **@ 1.0 m/s (200 LFM):** ~1.7 °C/W * **@ 3.5 m/s (700 LFM):** ~0.9 °C/W #### 3. pushPIN™ Attachment Unlike adhesive tapes, this part uses a mechanical **pushPIN™** system. This ensures a consistent, secure pressure against the electronic chip, which is critical for maximizing heat transfer and maintaining long-term reliability in high-vibration environments. #### 4. Pre-applied TIM (Thermal Interface Material) The unit comes with **T766** pre-applied. This is a high-performance phase-change or grease-like material that fills microscopic air gaps between the chip surface and the heat sink base. --- ### ## Component Identification (Part Number Breakdown) To understand variations of this part, here is how the code is structured: * **ATS:** Manufacturer (Advanced Thermal Solutions) * **15:** series/attachment type * **F:** Fin style (Tapered) * **13:** Dimensional height indicator * **C2:** Material/Color (Blue Anodized Aluminum) * **R0:** Revision/Packaging code
    ✨ Follow-up Questions
    • ⤷ What are the compatible mounting hole patterns for the pushPIN system on this heat sink?
    • ⤷ How does the T766 TIM compare to standard thermal pads in terms of conductivity?
    • ⤷ Are there specific airflow direction requirements for the tapered fin design?