ATS-15F-13-C2-R0
AI

The **ATS-15F-13-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to provide high efficiency in cooling electronic components like CPUs, FPGAs, and ASICs.
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### ## Technical Specifications
Below are the primary physical and thermal properties of this specific part number:
| Property | Value / Description |
| :--- | :--- |
| **Part Number** | ATS-15F-13-C2-R0 |
| **Material** | Aluminum (Blue Anodized) |
| **Dimensions (LxWxH)** | 50.0mm x 50.0mm x 12.7mm |
| **Fin Style** | Tapered Fin (maxiFLOW™) |
| **Attachment Method** | pushPIN™ (Pre-drilled holes) |
| **Thermal Interface Material (TIM)** | T766 (High Performance) |
| **Color** | Blue |
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### ## Key Electronic & Thermal Features
#### 1. maxiFLOW™ Fin Design
The "maxiFLOW" geometry features a tapered fin design that increases the surface area while reducing pressure drop. In electronics, this allows for maximum heat dissipation even in environments with low-velocity airflow.
#### 2. Thermal Resistance
The efficiency of a heat sink is measured by its thermal resistance (lower is better).
* **@ 1.0 m/s (200 LFM):** ~1.7 °C/W
* **@ 3.5 m/s (700 LFM):** ~0.9 °C/W
#### 3. pushPIN™ Attachment
Unlike adhesive tapes, this part uses a mechanical **pushPIN™** system. This ensures a consistent, secure pressure against the electronic chip, which is critical for maximizing heat transfer and maintaining long-term reliability in high-vibration environments.
#### 4. Pre-applied TIM (Thermal Interface Material)
The unit comes with **T766** pre-applied. This is a high-performance phase-change or grease-like material that fills microscopic air gaps between the chip surface and the heat sink base.
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### ## Component Identification (Part Number Breakdown)
To understand variations of this part, here is how the code is structured:
* **ATS:** Manufacturer (Advanced Thermal Solutions)
* **15:** series/attachment type
* **F:** Fin style (Tapered)
* **13:** Dimensional height indicator
* **C2:** Material/Color (Blue Anodized Aluminum)
* **R0:** Revision/Packaging code
- ⤷
What are the compatible mounting hole patterns for the pushPIN system on this heat sink?
- ⤷ How does the T766 TIM compare to standard thermal pads in terms of conductivity?
- ⤷ Are there specific airflow direction requirements for the tapered fin design?