## Technical Overview: ATS-15F-133-C2-R0 The **ATS-15F-133-C2-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the **push-PIN™** series, designed for efficient thermal management of electronic components such as CPUs, GPUs, and power modules. --- ### 1. Key Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Model Number** | ATS-15F-133-C2-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | push-PIN™ | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | | **Heat Sink Type** | Fine Pitch (straight fin) | --- ### 2. Physical Dimensions Detailed physical geometry is critical for PCB layout and clearance planning: * **Size (L x W):** 70.00 mm x 70.00 mm * **Height:** 10.00 mm (Low Profile) * **Fin Pitch:** Fine * **Weight:** Approximately 110-120 grams (Typical for these dimensions) --- ### 3. Thermal Performance (Degrees C/W) Performance varies based on the airflow (Linear Feet per Minute - LFM) provided by the system fans. | Airflow (LFM) | 100 (0.5 m/s) | 200 (1.0 m/s) | 400 (2.0 m/s) | 600 (3.0 m/s) | | :--- | :---: | :---: | :---: | :---: | | **Unducted Flow** | 7.42 | 3.38 | 2.01 | 1.55 | | **Ducted Flow** | 2.25 | 1.45 | 1.15 | 1.00 | --- ### 4. Components & Features 1. **High-Efficiency Fins:** The straight-fin design is optimized for high-density airflow environments. 2. **Push-PIN™ Attachment:** * Utilizes a brass component with a stainless steel spring for consistent pressure. * Ensures a secure fit to the PCB, preventing shifting during vibration or shipping. 3. **T766 Thermal Interface Material:** * Comes pre-applied to the base. * Provides excellent thermal conductivity between the heat source and the aluminum base, eliminating the need for separate thermal paste application. 4. **Blue Anodized Coating:** Provides corrosion resistance and a professional aesthetic finish. --- ### 5. Application Usage This specific heat sink is ideal for: * **Networking Equipment:** Switches and routers where space is limited but power density is high. * **Embedded Systems:** Industrial PCs requiring rugged, vibration-resistant cooling solutions. * **Legacy Hardware Upgrades:** Fitting within specific 1U or low-profile chassis constraints.