The **ATS-15F-134-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Property | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Attachment Type** | Push-pin (Brass) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 70.00mm x 70.00mm | | **Height** | 15.00mm | | **Fin Style** | Fine Pitch (Cross-Cut) | | **Thermal Resistance** | ~4.44°C/W (at 100 LFM) | --- ## 2. Key Features ### A. pushPIN™ Attachment This model utilizes a specialized push-pin mechanism. This allows for: * **Fast Assembly:** Easy installation to the PCB with pre-drilled holes. * **Constant Pressure:** A high-performance compression spring ensures even pressure across the thermal interface material (TIM). * **Security:** Reduces the risk of the heat sink shifting during mechanical shock or vibration. ### B. Cross-Cut Fin Design Unlike straight-fin heat sinks, the "Fine Pitch" cross-cut design allows for: * **Multi-directional Airflow:** It can dissipate heat effectively regardless of which direction the fan is blowing. * **Increased Surface Area:** Maximizes the area available for heat exchange within a low-profile (15mm) height. ### C. Blue Anodized Finish The blue anodizing isn't just for aesthetics; it provides **corrosion resistance** and slightly improves **surface emissivity**, which helps in radiative heat transfer. --- ## 3. Thermal Performance Data Thermal management effectiveness depends on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 4.44 | | 300 (1.5 m/s) | 2.06 | | 500 (2.5 m/s) | 1.62 | | 700 (3.5 m/s) | 1.40 | --- ## 4. Typical Applications * **Embedded Systems:** For compact industrial PCs. * **Telecommunications:** High-speed routers and switches. * **Power Electronics:** Cooling MOSFETs or IGBT modules. * **Automotive:** Electronic Control Units (ECUs) requiring vibration-resistant mounting.