The **ATS-15F-140-C2-R0** is a high-performance electronic thermal management component, specifically a **heat sink** designed for cooling integrated circuits (ICs) and other surface-mount components. Below is a detailed breakdown of its specifications and electronic application characteristics. --- ## 1. Technical Specifications This part belongs to the **pushPIN™** series by Advanced Thermal Solutions (ATS). | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Fin Type** | Fine Pitch (Cross-Cut) | | **Thermal Resistance** | 7.28°C/W (@ 100 LFM) | | **Dimensions (L x W)** | 25.00mm x 25.00mm | | **Height (Height Off Base)** | 25.00mm | | **Hole Pattern** | 20.00mm x 20.00mm | --- ## 2. Key Component Features ### A. Material and Coating The heat sink is made from **Aluminum**, which offers a high strength-to-weight ratio and excellent thermal conductivity. The **Blue Anodized** finish is not just aesthetic; it provides: * Increased corrosion resistance. * Improved surface emissivity for better radiant heat transfer. * Electrical insulation of the heat sink surface. ### B. Thermal Performance The "Fine Pitch" design maximizes surface area within a small 25mm footprint. Thermal resistance varies based on airflow: * **Low Airflow (100 LFM):** 7.28°C/W * **High Airflow (700 LFM):** 2.14°C/W *This indicates the component is highly dependent on active cooling (fans) for maximum efficiency.* ### C. Attachment Mechanism (pushPIN™) Unlike adhesive tapes that can fail over time due to heat, this part uses a mechanical **Push-Pin** system: * **Reliability:** Ensures consistent pressure (clamping force) between the heat sink and the electronic chip. * **Springs:** Usually paired with a compression spring to prevent damage to the silicon die while maintaining contact. --- ## 3. Electronic Application This specific size (25mm x 25mm) is commonly used for: * **BGA (Ball Grid Array) Chips:** Processors, FPGAs, and high-speed memory. * **Embedded Systems:** Microcontrollers that generate significant heat in a compact space. * **Network Equipment:** Routers and switches where vertical height (25mm) allows for chimney-effect cooling. --- ## 4. Ordering Nomenclature Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **15F** | Series/Designator | | **140** | Dimension/Model Code | | **C2** | Thermal Interface Material (Pre-applied Phase Change or Foil) | | **R0** | RoHS Compliant / Revision Status |