The **ATS-15F-141-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). --- ## 1. Technical Specifications This part is designed for the cooling of electronic components such as CPUs, GPUs, FPGAs, or power modules. Below is a breakdown of its core characteristics: | Property | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 15.71°C/W (Unducted Flow @ 200 LFM) | | **Attachment Method** | pushPIN™ | | **Base Dimensions** | 25mm x 25mm | | **Height** | 10mm | | **Fin Style** | Straight | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Component Analysis ### A. Material and Design * **Aluminum Body:** Provides an excellent balance between thermal conductivity and weight. * **Blue Anodized Coating:** Increases surface emissivity (improving radiation cooling) and provides a protective layer against corrosion. * **Straight Fin Profile:** Optimized for air-flow environments where air can move linearly across the device. ### B. The pushPIN™ Attachment System This specific model features the ATS **pushPIN™** system. This is a mechanical mounting mechanism that: * Includes a flexible spring to ensure constant pressure. * Simplifies installation on Printed Circuit Boards (PCBs). * Prevents movement during vibration or shipping, which is critical for maintaining contact between the chip and the heat sink. ### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. This is a phase-change material or high-performance grease that fills microscopic air gaps between the heat sink and the electronic component, significantly reducing thermal resistance. --- ## 3. Part Number Breakdown (Nomenclature) | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Manufacturer) | | **15** | Series Number | | **F** | Fin Pitch / Density Code | | **141** | Specific Model Reference | | **C2** | Thermal Performance/Material Grade | | **R0** | Revision Code / RoHS Compliance | --- ## 4. Typical Applications * **Network Switches:** Cooling high-speed processing chips. * **Embedded Systems:** For industrial computers where space is limited. * **Power Supplies:** Managing heat in MOSFETs or voltage regulators.