ATS-15F-147-C3-R0
AI

The **ATS-15F-147-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure.
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### 1. Technical Specifications
The part number follows a specific nomenclature that defines its physical and thermal characteristics.
| Specification | Details |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Attachment Type** | Push-Pin (Plastic or Brass) |
| **Material** | Aluminum (typically Blue Anodized) |
| **Thermal Resistance** | 13.65°C/W (Unducted Flow @ 100 LFM) |
| **Fin Type** | Fine Pitch (Straight Fin) |
### 2. Physical Dimensions
Precision sizing is critical for ensuring the heat sink fits within the PCB footprint without interfering with adjacent components.
| Dimension | Measurement |
| :--- | :--- |
| **Length/Width** | 35.00 mm x 35.00 mm |
| **Height** | 10.00 mm |
| **Pitch** | 1.14 mm (Fin spacing) |
| **Hole Spacing** | 40.00 mm |
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### 3. Key Electronic/Thermal Features
* **pushPIN™ Attachment:** This model uses a spring-loaded push-pin mechanism. This provides a consistent "clamping force" against the electronic component, ensuring maximum surface contact and optimal heat transfer.
* **High Performance Fins:** The "147" series uses a specific fin density designed for low-profile applications where vertical space is limited (only 10mm high).
* **Material Efficiency:** Made from high-grade aluminum, it balances weight and thermal conductivity. The Blue Anodized finish increases surface emissivity and provides corrosion resistance.
* **Pre-Applied TIM:** Most models in this series come with a **Thermal Interface Material (TIM)** pre-applied to the base, simplifying the assembly process in mass production.
### 4. Application Use Cases
* **Embedded Systems:** For compact industrial PCs.
* **Networking Gear:** Cooling ASICs in routers and switches.
* **Power Supplies:** Managing heat in high-efficiency voltage regulators.
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### 5. Part Number Breakdown
* **ATS:** Advanced Thermal Solutions (Brand)
* **15F:** Series/Frame size designation
* **147:** Specific internal geometry/fin configuration
* **C3:** Material/Color (Blue Anodized)
* **R0:** Revision/Packaging code
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What are the advantages of using push-pin mounts over adhesive thermal tape?
- ⤷ How does the 'LFM' (Linear Feet per Minute) airflow affect the thermal resistance of this part?
- ⤷ Is there a copper-base version of this heat sink for higher power density?