ATS-15F-157-C2-R0
AI

The **ATS-15F-157-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" series designed for thermal management of electronic components like CPUs, GPUs, and other high-heat surface-mount devices.
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### 1. Technical Specifications
The part number itself contains encoded information about its physical and thermal characteristics.
| Specification | Details |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded pins) |
| **Thermal Resistance** | 3.35 °C/W (at 100 LFM) |
| **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 10.00mm |
| **Pitch** | Fine Pitch (Pattern: XC-cut) |
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### 2. Key Component Features
#### A. Thermal Interface Material (TIM)
* **Pre-applied Phase Change Material:** This unit comes with **T766** pre-applied to the base.
* **Function:** It fills microscopic air gaps between the component surface and the heat sink to ensure maximum heat transfer.
#### B. Attachment System (pushPIN™)
* **Hardware:** It utilizes a flexible "push pin" system with a built-in spring.
* **Advantage:** This provides a precise "compression force" (3.0kgf to 7.0kgf depending on the spring) which prevents damage to the silicon die while ensuring the heat sink stays flush against the chip.
#### C. XC-Cut Fin Design
* **Geometry:** The heat sink features an "XC-cut" or cross-cut fin pattern.
* **Airflow:** This design is optimized for environments where airflow may be inconsistent, allowing air to pass through from multiple directions rather than just one.
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### 3. Applications in Electronics
This specific part is typically used in:
* **Telecommunications:** Cooling of networking processors.
* **Embedded Systems:** Industrial PCs and controllers.
* **Power Electronics:** Managing heat for VRMs (Voltage Regulator Modules) or power transistors.
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### 4. Dimensional Drawing Summary
| Feature | Measurement |
| :--- | :--- |
| **Length (A)** | 40.00 mm |
| **Width (B)** | 40.00 mm |
| **Height (C)** | 10.00 mm |
| **Hole Pattern (E/F)** | 33.00 mm x 33.00 mm |
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How does the 'C2' designation in the part number affect the pricing or material?
- ⤷ What is the recommended airflow (LFM) for optimal performance of this heat sink?
- ⤷ Can the pushPIN attachment be reused if the heat sink is removed?