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  • ATS-15F-16-C2-R0

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    The **ATS-15F-16-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It belongs to the **pushPIN™** series. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Attachment Method** | Push-Pin (Plastic) | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 54.00 mm x 54.00 mm | | **Height (H)** | 10.00 mm | | **Pitch** | 1.14 mm | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Design and Component Breakdown #### A. Fin Geometry (Flat Back) The "16" in the part number indicates a specific fin pattern. This model uses a **Square-Fin** or **cross-cut** design which allows for multi-directional airflow. This is critical for dense electronic enclosures where airflow direction may be turbulent or inconsistent. #### B. Attachment Mechanism: pushPIN™ Unlike adhesive tapes or heavy screws, the push-pin system uses: * **Compression Springs:** These ensure a precise and consistent pressure across the surface of the electronic chip (CPU, GPU, or FPGA). * **Plastic Pins:** These snap into pre-drilled holes on the PCB (Printed Circuit Board). #### C. Thermal Performance The efficiency of this heat sink is measured by its thermal resistance (lower is better): * **Unducted Flow:** ~18.00 °C/W @ 100 LFM. * **Ducted Flow:** ~1.50 °C/W @ 100 LFM. --- ### 3. Part Number Decoder Understanding the nomenclature helps in selecting variants: | Segment | Meaning | Detail | | :--- | :--- | :--- | | **ATS** | Manufacturer | Advanced Thermal Solutions | | **15** | Attachment Type | pushPIN™ style | | **F** | Fin Style | Flat Back / High Performance | | **16** | Size/Design Code | Specific geometry reference | | **C2** | Material/Color | Aluminum / Blue Anodized | | **R0** | RoHS Status | Compliant with environmental standards | --- ### 4. Implementation Example To integrate this into a hardware design, the PCB layout must account for the specific hole pattern: ```text PCB Layout Requirements: - Hole Diameter: 3.175 mm (approx.) - Hole Spacing: 47.00 mm (Center-to-Center) - Component Clearance: 54mm x 54mm footprint ```
    ✨ Follow-up Questions
    • ⤷What are the advantages of using push-pins over thermal adhesive tape?
    • ⤷ Can this heat sink be used with a custom Thermal Interface Material (TIM)?
    • ⤷ How does the height of 10mm affect its cooling capacity compared to taller models?