ATS-15F-16-C2-R0
AI

The **ATS-15F-16-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It belongs to the **pushPIN™** series.
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### 1. Technical Specifications
Below are the primary physical and thermal characteristics of this component:
| Feature | Specification |
| :--- | :--- |
| **Series** | pushPIN™ |
| **Material** | Aluminum (AL6063) |
| **Attachment Method** | Push-Pin (Plastic) |
| **Finish** | Blue Anodized |
| **Dimensions (L x W)** | 54.00 mm x 54.00 mm |
| **Height (H)** | 10.00 mm |
| **Pitch** | 1.14 mm |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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### 2. Design and Component Breakdown
#### A. Fin Geometry (Flat Back)
The "16" in the part number indicates a specific fin pattern. This model uses a **Square-Fin** or **cross-cut** design which allows for multi-directional airflow. This is critical for dense electronic enclosures where airflow direction may be turbulent or inconsistent.
#### B. Attachment Mechanism: pushPIN™
Unlike adhesive tapes or heavy screws, the push-pin system uses:
* **Compression Springs:** These ensure a precise and consistent pressure across the surface of the electronic chip (CPU, GPU, or FPGA).
* **Plastic Pins:** These snap into pre-drilled holes on the PCB (Printed Circuit Board).
#### C. Thermal Performance
The efficiency of this heat sink is measured by its thermal resistance (lower is better):
* **Unducted Flow:** ~18.00 °C/W @ 100 LFM.
* **Ducted Flow:** ~1.50 °C/W @ 100 LFM.
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### 3. Part Number Decoder
Understanding the nomenclature helps in selecting variants:
| Segment | Meaning | Detail |
| :--- | :--- | :--- |
| **ATS** | Manufacturer | Advanced Thermal Solutions |
| **15** | Attachment Type | pushPIN™ style |
| **F** | Fin Style | Flat Back / High Performance |
| **16** | Size/Design Code | Specific geometry reference |
| **C2** | Material/Color | Aluminum / Blue Anodized |
| **R0** | RoHS Status | Compliant with environmental standards |
---
### 4. Implementation Example
To integrate this into a hardware design, the PCB layout must account for the specific hole pattern:
```text
PCB Layout Requirements:
- Hole Diameter: 3.175 mm (approx.)
- Hole Spacing: 47.00 mm (Center-to-Center)
- Component Clearance: 54mm x 54mm footprint
```
- ⤷What are the advantages of using push-pins over thermal adhesive tape?
- ⤷ Can this heat sink be used with a custom Thermal Interface Material (TIM)?
- ⤷ How does the height of 10mm affect its cooling capacity compared to taller models?