The **ATS-15F-161-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) and surface-mount devices (SMD). --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Attribute | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 45mm x 45mm | | **Height (Off Base)** | 20mm | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Thermal Resistance** | 4.74°C/W (at 100 LFM) | | **Flow Pattern** | COARSE-PITCH (Straight Fin) | --- ### 2. Breakdown of the Part Number The nomenclature for ATS heat sinks provides specific details about the component: * **ATS-15**: Indicates the series and standard sizing profile. * **F**: Denotes the fin pitch (in this case, typically a specific density for airflow). * **161**: Refers to the specific dimensions and internal geometry of the fins. * **C2**: Indicates the **Thermal Interface Material (TIM)**. C2 usually refers to **T766**, a high-performance thermal phase-change material or grease pre-applied to the base. * **R0**: Refers to the revision and the RoHS compliance status (standard commercial version). --- ### 3. Key Features * **pushPIN™ Attachment:** Uses a flexible attachment system that allows for easy installation and consistent pressure on the heat source, ensuring better thermal contact. * **Material:** Made from lightweight aluminum with high thermal conductivity. * **Blue Anodized Finish:** Provides surface protection against corrosion and slightly improves radiant heat transfer. * **Straight Fin Design:** Optimized for environments where there is a clear, directional airflow (forced convection). --- ### 4. Typical Applications This part is commonly used in the following electronic systems: 1. **Network Switches/Routers:** Cooling high-speed processors. 2. **Embedded Systems:** For industrial PCs and controllers. 3. **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators. 4. **FPGA/ASIC Cooling:** Protecting custom integrated circuits from thermal throttling.