The **ATS-15F-170-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed for cooling electronic components like CPUs, GPUs, or power transistors. ### 1. Technical Specifications The following table summarizes the key physical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Attachment Type** | Push-pin (for easy mounting) | | **Thermal Resistance** | 10.11 °C/W (at 100 LFM) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 30mm x 30mm | | **Height** | 15mm | --- ### 2. Design and Engineering Features This specific model belongs to the **pushPIN™** line, which focuses on versatile and secure attachment. * **Fine Pitch Fin Design:** The "F" in the part number often indicates a fine pitch fin structure. This maximizes surface area, allowing for better heat dissipation in airflow-constrained environments. * **Pre-assembled Push-Pins:** It comes with a flexible, brass-tipped push-pin and a high-compression spring. This ensures consistent pressure across the component for optimal heat transfer. * **Thermal Interface Material (TIM):** This part usually comes pre-applied with **T766** high-performance phase-change material, which eliminates the need for manual thermal paste application. ### 3. Part Number Breakdown Understanding the nomenclature helps in identifying its function: | Segment | Meaning | | :--- | :--- | | **ATS-15** | ATS Product Series | | **F** | Fin Pitch (Fine) | | **170** | Specific thermal/physical configuration code | | **C2** | Thermal Interface Material (TIM) code | | **R0** | RoHS compliant / Revision status | --- ### 4. Application Use Cases The ATS-15F-170-C2-R0 is typically used in the following scenarios: * **Embedded Systems:** Where PCB space is limited but thermal loads are high. * **Telecommunications:** For cooling signal processing chips on daughterboards. * **Industrial Controls:** Protecting power components from overheating in enclosed cabinets.