ATS-15F-174-C2-R0
AI

The part number **ATS-15F-174-C2-R0** refers to a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). This specific component belongs to the "push-pin" series designed for cooling electronic components like CPUs, GPUs, or FPGAs.
---
### 1. Technical Specifications
The part number itself acts as a code for its physical and thermal characteristics.
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic) |
| **Spring Type** | Compression Spring |
| **Thermal Resistance** | 4.02°C/W (at 200 LFM) |
| **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 35.00mm |
| **Fin Style** | Straight Fin |
---
### 2. Design and Components
This heat sink is composed of three primary electronic/mechanical segments:
* **The Heat Sink Body:** Made of aluminum for optimal thermal conductivity. The "Straight Fin" design allows for efficient vertical airflow, making it ideal for systems with high-velocity air cooling.
* **Push-Pin Attachment:** This uses a plastic push-pin mechanism. It is designed to be inserted through pre-drilled holes in a Printed Circuit Board (PCB), ensuring a secure and repeatable fit without the need for adhesive.
* **Thermal Interface Material (TIM):** The "-R0" designation typically implies the inclusion of a pre-applied Phase Change Material or high-performance thermal pad on the base to ensure low thermal resistance between the component and the sink.
---
### 3. Decoding the Part Number
Advanced Thermal Solutions uses a standardized naming convention:
| Code Segment | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer (Advanced Thermal Solutions) |
| **15F** | Series/Product Family (Push-Pin Heat Sinks) |
| **174** | Specific Geometric/Thermal Model Identifier |
| **C2** | Material/Finish (Blue Anodized Aluminum) |
| **R0** | Packaging/Thermal Interface Specification |
---
### 4. Typical Applications
* **Embedded Systems:** Cooling small-form-factor processors.
* **Telecommunications:** Used on high-speed network switches.
* **Power Supplies:** Dissipating heat from voltage regulators.
- ⤷
What are the PCB hole requirements for the push-pin attachment?
- ⤷ How does 'Blue Anodized' finish affect thermal performance compared to bare aluminum?
- ⤷ Can this heat sink be used with a custom thermal paste instead of the R0 pad?