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  • ATS-15F-174-C2-R0

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    The part number **ATS-15F-174-C2-R0** refers to a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). This specific component belongs to the "push-pin" series designed for cooling electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number itself acts as a code for its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 4.02°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 35.00mm | | **Fin Style** | Straight Fin | --- ### 2. Design and Components This heat sink is composed of three primary electronic/mechanical segments: * **The Heat Sink Body:** Made of aluminum for optimal thermal conductivity. The "Straight Fin" design allows for efficient vertical airflow, making it ideal for systems with high-velocity air cooling. * **Push-Pin Attachment:** This uses a plastic push-pin mechanism. It is designed to be inserted through pre-drilled holes in a Printed Circuit Board (PCB), ensuring a secure and repeatable fit without the need for adhesive. * **Thermal Interface Material (TIM):** The "-R0" designation typically implies the inclusion of a pre-applied Phase Change Material or high-performance thermal pad on the base to ensure low thermal resistance between the component and the sink. --- ### 3. Decoding the Part Number Advanced Thermal Solutions uses a standardized naming convention: | Code Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **15F** | Series/Product Family (Push-Pin Heat Sinks) | | **174** | Specific Geometric/Thermal Model Identifier | | **C2** | Material/Finish (Blue Anodized Aluminum) | | **R0** | Packaging/Thermal Interface Specification | --- ### 4. Typical Applications * **Embedded Systems:** Cooling small-form-factor processors. * **Telecommunications:** Used on high-speed network switches. * **Power Supplies:** Dissipating heat from voltage regulators.
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for the push-pin attachment?
    • ⤷ How does 'Blue Anodized' finish affect thermal performance compared to bare aluminum?
    • ⤷ Can this heat sink be used with a custom thermal paste instead of the R0 pad?