The **ATS-15F-177-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for secure and efficient cooling of integrated circuits (ICs) and other PCB components. --- ### Technical Specifications The following table summarizes the key physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 20.00mm | | **Fin Type** | Fine-Pitch (Straight) | | **Thermal Resistance** | 6.18 °C/W (Unducted Flow @ 100 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### Key Electronic & Mechanical Features #### 1. Push-Pin Attachment Mechanism Instead of relying on adhesives or complex screws, this part uses a **push-pin** system. This provides: * **Constant Pressure:** Ensures the heat sink is pressed firmly against the component for optimal heat transfer. * **Easy Assembly:** Quick installation via pre-drilled holes in the PCB. * **Vibration Resistance:** Designed to remain secure even in high-vibration environments. #### 2. Thermal Performance The unit is engineered for **forced convection** (airflow). * **Low Flow (100 LFM):** 6.18 °C/W resistance. * **High Flow (700 LFM):** 1.85 °C/W resistance. As airflow increases, the efficiency of the heat dissipation improves significantly, making it suitable for server racks or high-speed telecommunications equipment. #### 3. Thermal Interface Material (TIM) The part comes with **T766** pre-applied. This is a phase-change or high-conductivity material that fills microscopic air gaps between the heat sink and the chip, significantly reducing thermal impedance without the need for manual thermal paste application. --- ### Typical Applications This specific heat sink size and profile are commonly found in: * **Networking Gear:** Switches, routers, and hubs. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Regulating heat for MOSFETs or small DC-DC converters.