ATS-15F-18-C2-R0
AI

The **ATS-15F-18-C2-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the "blue ice" series, designed primarily for cooling integrated circuits (ICs), BGAs, and other surface-mount components.
### 1. Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Part Family** | pushPIN™ Heat Sink Assembly |
| **Material** | Aluminum (Anodized Blue) |
| **Attachment Method** | Push-Pin (Plastic/Brass) |
| **Thermal Resistance** | 13.38°C/W (at 100 LFM) |
| **Dimensions (L x W)** | 54mm x 54mm |
| **Height (Fin Height)** | 15mm |
| **Fin Pitch/Type** | Fine Pitch / Straight Fin |
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### 2. Breakdown of the Part Number
The alphanumeric code follows a specific naming convention used by ATS to identify the product's physical and thermal characteristics:
* **ATS-15**: Indicates the specific series and size profile.
* **F**: Represents the Fin Pitch (Fine Pitch).
* **18**: Designates the specific fin pattern or height variation.
* **C2**: Refers to the material and finish (usually T766 finish or specific thermal interface material).
* **R0**: Indicates the revision number or packaging type.
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### 3. Key Electronic Functions
Electronic parts like the ATS-15F-18-C2-R0 are "passive" components. Their primary roles in a circuit are:
1. **Thermal Management**: It dissipates heat generated by high-performance chips (CPUs, GPUs, FPGAs) to prevent thermal throttling or hardware failure.
2. **Increased Surface Area**: The "Straight Fin" design increases the area exposed to the air, allowing for better heat exchange via convection.
3. **Mechanical Stability**: The push-pin attachment mechanism ensures a constant pressure is applied to the thermal interface material (TIM), ensuring maximum heat transfer efficiency.
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### 4. Component Comparison: Active vs. Passive Cooling
| Feature | ATS-15F-18-C2-R0 (Passive) | Active Cooling (Fan/Sink Combo) |
| :--- | :--- | :--- |
| **Power Consumption** | 0W (No power needed) | 1W - 5W (Fan motor) |
| **Noise Level** | Silent | Audible (Fan noise) |
| **Reliability** | High (No moving parts) | Moderate (Fan can fail) |
| **Ideal Environment** | High-airflow chassis | Low-airflow or enclosed spaces |
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What are the compatible push-pin sizes for this specific heat sink model?
- ⤷ How does 'LFM' airflow speed affect the thermal resistance of this part?
- ⤷ What type of thermal interface material (TIM) is pre-applied to the C2 series?