The **ATS-15F-181-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the physical and thermal properties of the heat sink. | Feature | Specification | | :--- | :--- | | **Series** | pushPIN™ Heat Sink Assembly | | **Material** | Aluminum (AL6063) | | **Attachment Type** | Push-Pin | | **Fin Style** | Straight (Fine Pitch) | | **Thermal Resistance** | 11.95°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W)** | 40.00mm x 40.00mm | | **Height** | 10.00mm | | **Finish** | Blue Anodized | | **Thermal Interface (TIM)** | T766 (Pre-applied Phase Change Material) | --- ### 2. Design Breakdown #### A. The Fin Geometry The **181** series features a specific fin design optimized for high-density electronic boards. The straight-fin design allows for efficient airflow across the surface area, reducing the temperature of the underlying semiconductor (CPU, GPU, or FPGA). #### B. The Push-Pin Mechanism The **"F"** and **"C2"** designations refer to the attachment hardware. * **Secure Mounting:** It uses a brass push-pin with a stainless steel spring. * **Compression:** This ensures constant pressure on the chip, which is vital for the thermal interface material to work effectively. #### C. Material and Coating * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodized Finish:** Provides corrosion resistance and increases surface emissivity (improving radiative heat transfer). --- ### 3. Thermal Performance Profile Thermal resistance varies based on the airflow velocity (LFM - Linear Feet per Minute): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 11.95 | | 200 (1.0 m/s) | 6.40 | | 300 (1.5 m/s) | 5.08 | | 400 (2.0 m/s) | 4.35 | --- ### 4. Typical Applications This specific heat sink size (40x40x10mm) is commonly used for: 1. **Network Switches/Routers:** Cooling ASICs and processors. 2. **Industrial PCs:** Compact cooling for embedded systems. 3. **Power Supplies:** Heat dissipation for MOSFETs and Voltage Regulators.