The **ATS-15F-186-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) to prevent overheating. --- ### 1. Technical Specifications The following table summarizes the physical and thermal properties of this specific model: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Dimensions** | 40mm x 40mm x 35mm | | **Thermal Resistance** | 2.80°C/W (at 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Breakdown of the Model Number The part number follows a specific naming convention used by ATS to describe its features: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **15**: Internal product series identifier. * **F**: Fin design type (Cross-Cut, high-efficiency fins). * **186**: Specific footprint and geometry identifier. * **C2**: Finish type (Blue Anodized). * **R0**: RoHS compliance and revision status. --- ### 3. Key Electronic Features * **pushPIN™ Attachment:** This heat sink uses a spring-loaded push-pin mechanism. This ensures consistent pressure between the heat sink and the electronic component, which is critical for maximizing heat transfer. * **High Aspect Ratio Fins:** The "F" series design utilizes thin fins with high density to provide a large surface area for air cooling within a small 40x40mm footprint. * **Pre-applied TIM:** It comes with **T766 thermal interface material** already applied to the base. This eliminates the need for manual thermal paste application and ensures a bubble-free connection to the CPU/GPU or power MOSFET. * **Versatile Cooling:** It is optimized for both natural convection and forced-air (fan-assisted) cooling environments. --- ### 4. Common Applications This part is typically found in: 1. **Networking Hardware:** Routers, switches, and base stations. 2. **Industrial PCs:** Compact embedded systems where space is limited. 3. **Power Supplies:** Cooling voltage regulators and power converters. 4. **Consumer Electronics:** High-end audio/video processing units.