The **ATS-15F-19-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. It is manufactured by Advanced Thermal Solutions (ATS) as part of their "push pin" series. --- ### 1. Technical Specifications The part number encodes specific data regarding its physical and thermal characteristics: | Specification | Details | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Heat Sink Type** | Push Pin (Straight Fin) | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 35mm x 35mm x 20mm | | **Thermal Resistance** | 9.77°C/W (Unducted Flow @ 200 LFM) | | **Attachment Method** | Plastic Push Pin with Brass Springs | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Physical Design Features The construction of this part is optimized for airflow and ease of assembly: * **Straight Fin Profile:** The fins are arranged in a straight pattern, making it ideal for systems with a defined directional airflow (forced convection). * **Push Pin Mounting:** Instead of using adhesive tapes or thermal epoxy, this model uses a mechanical push-pin system. This provides consistent pressure on the chip, improving heat transfer and allowing for easier removal or rework. * **Blue Anodized Finish:** The surface treatment is not just aesthetic; anodizing increases the surface emissivity, which slightly improves radiative heat transfer and protects the aluminum from corrosion. --- ### 3. Thermal Performance Context The "C2" in the part number indicates the thermal performance category and the specific thermal interface material (TIM). * **T766 TIM:** This is a phase-change material applied to the base. When the component heats up, the material softens to fill microscopic gaps between the chip and the heatsink, significantly reducing thermal resistance. * **Airflow Dependency:** Thermal resistance drops significantly as airflow increases: * **@ 200 LFM:** 9.77°C/W * **@ 500 LFM:** 4.30°C/W --- ### 4. Typical Applications This heatsink is commonly found in: 1. **Networking Hardware:** Routers, switches, and gateways. 2. **Embedded Systems:** Industrial PCs and controllers. 3. **Power Electronics:** Voltage regulators and high-speed processors that generate moderate heat in a small footprint. ---