The **ATS-15F-191-C2-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, specifically designed for cooling electronic components like CPUs, GPUs, and other high-heat-density integrated circuits. --- ### 1. Technical Specifications Below is a breakdown of the physical and thermal properties of this specific model: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (with Blue Anodized finish) | | **Dimensions** | 45mm x 45mm x 30mm | | **Thermal Resistance** | 2.90 °C/W (at 200 LFM) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Interface Material** | T766 (High-performance thermal grease) | | **Regulatory Compliance** | RoHS & REACH Compliant | --- ### 2. Key Design Features #### A. Fin Geometry (maxiFLOW™) The heat sink features a **spread-fin pattern**. Unlike traditional straight-fin sinks, these fins flare outwards. This design reduces pressure drop and increases the surface area exposed to airflow, making it highly efficient in forced-air environments. #### B. pushPIN™ Attachment Instead of using adhesive tape which can fail over time, this part uses a mechanical **pushPIN™** system: * **Precision Springs:** Ensure consistent pressure across the surface for optimal heat transfer. * **Compression:** Prevents the heat sink from shifting during mechanical shock or vibration. #### C. Thermal Interface Material (TIM) The unit comes pre-applied with **T766 thermal grease**. This eliminates the need for manual application during assembly, ensuring a uniform layer between the component and the heat sink base. --- ### 3. Application Use Cases This part is typically found in: 1. **Network Switches/Routers:** Cooling high-speed processing chips. 2. **Embedded Systems:** For industrial PCs where space is limited but heat generation is high. 3. **Power Supplies:** Managing thermal output in DC-DC converters. ---