The **ATS-15F-197-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" series designed for cooling electronic components, typically Integrated Circuits (ICs), BGAs, and processors. --- ## 1. Technical Specifications Below are the primary mechanical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-15F-197-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 10.00mm | | **Thermal Resistance** | 10.90°C/W @ 100 LFM (undirected flow) | | **Thermal Interface Material** | T766 (Pre-applied Phase Change Material) | --- ## 2. Component Breakdown ### A. Material and Design * **Aluminum Construction:** Aluminum provides a balance between weight and thermal conductivity. * **Finned Array:** The device uses a high-density fin structure to maximize surface area, allowing heat to dissipate into the surrounding air more efficiently. * **Blue Anodized Coating:** This is not just for aesthetics; the anodized layer increases surface emissivity and provides corrosion resistance. ### B. The Attachment Mechanism (Push-Pin) This part utilizes a **Brass Push-Pin** with a **Compression Spring**. 1. **Uniform Pressure:** The spring ensures consistent pressure across the surface of the chip, improving thermal contact. 2. **Stability:** The push-pin locks into pre-drilled holes in the PCB, preventing the heat sink from shifting during vibration or shipping. ### C. Thermal Interface Material (TIM) The **C2** suffix in the part number indicates the specific TIM used. * **T766:** This is a high-performance phase-change material. When the chip heats up, the material softens to fill microscopic air gaps between the chip and the heat sink, significantly reducing thermal resistance compared to a dry fit. --- ## 3. Application Use Cases This specific heat sink is typically found in: * **Network Switches/Routers:** Cooling ASICs and high-speed processors. * **Embedded Systems:** Industrial PCs where vertical space is limited (10mm height). * **Power Supplies:** Cooling voltage regulators or MOSFETs. ---