The **ATS-15F-203-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** series, designed to provide efficient cooling for electronic components like CPUs, GPUs, and other high-power ICs. --- ## Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-15F-203-C2-R0 | | **Heat Sink Type** | pushPIN™ HS | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Thermal Resistance** | 8.95°C/W (@ 100 LFM) to 2.22°C/W (@ 700 LFM) | --- ## Key Components and Features ### 1. The Fin Design (XC Cut) The "XC" design refers to a **Cross-Cut** fin pattern. Unlike straight fins, cross-cut fins allow for multi-directional airflow. This is critical in cramped electronic enclosures where airflow may not be strictly linear. ### 2. Physical Dimensions The dimensions are standardized for specific PCB footprints: * **Length/Width:** 54mm x 54mm * **Height:** 10mm (Low profile) * **Pitch:** 47mm (Distance between mounting holes) ### 3. Attachment Mechanism: pushPIN™ This part uses a spring-loaded push-pin assembly. * **Function:** It provides a specific, consistent pressure (clamping force) on the electronic component. * **Benefit:** Ensures maximum thermal contact between the component and the heat sink without damaging the PCB. * **Hardware:** Usually consists of a nylon or brass pin and a stainless steel spring. ### 4. Thermal Interface Material (TIM) The **"C2"** in the part number indicates the type of Thermal Interface Material pre-applied to the base. * **T766:** This is a high-performance thermal grease applied at the factory to eliminate air gaps between the heat sink and the chip. --- ## Performance Summary (Airflow vs. Thermal Resistance) | Air Velocity (LFM) | 100 | 300 | 500 | 700 | | :--- | :--- | :--- | :--- | :--- | | **Thermal Resistance (°C/W)** | 8.95 | 4.08 | 2.96 | 2.22 | *LFM = Linear Feet per Minute. Lower °C/W values indicate better cooling performance.* --- ## Application Use Cases * **Embedded Systems:** Due to its low 10mm profile, it fits in 1U server racks and slim industrial PCs. * **Power Supplies:** Used for cooling MOSFETs and VRMs. * **Telecommunications:** Cooling of high-speed networking processors.