The **ATS-15F-209-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Property | Specification | Details | | :--- | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | Part of the "pushPIN™" series | | **Material** | Aluminum | Lightweight with high thermal conductivity | | **Attachment Method** | pushPIN™ | Uses a spring-loaded pin mechanism | | **Fin Type** | XC-CUT | Cross-cut design for multidirectional airflow | | **Thermal Resistance** | 6.27°C/W (undirected) | Measured at 100 LFM (linear feet per minute) | | **Dimensions** | 70mm x 70mm x 10mm | Large surface area, low profile (10mm height) | | **Finish** | Blue Anodized | Increases surface area and corrosion resistance | | **TIM (Interface)** | T766 | Pre-applied Thermal Interface Material | --- ### 2. Key Features * **pushPIN™ Attachment:** This system features a flexible attachment mechanism that can be easily integrated into PCB holes. It ensures consistent pressure on the component for optimal heat transfer. * **Cross-Cut (XC) Fin Design:** Unlike straight-fin heat sinks, the cross-cut pattern allows air to move through the fins from multiple directions. This makes it ideal for systems where the airflow direction is inconsistent or restricted. * **Pre-applied TIM:** It comes with a high-performance Thermal Interface Material (T766) already applied to the base, reducing assembly time and ensuring a reliable bond between the chip and the sink. --- ### 3. Application Use Cases This specific heat sink is typically used in environments where vertical space is limited but horizontal space is available: 1. **Network Switches/Routers:** Cooling high-speed processing chips. 2. **Embedded Systems:** Industrial PCs with low-profile chassis. 3. **Power Electronics:** Dissipating heat from large surface-mount MOSFETs or power modules. --- ### 4. Thermal Performance Comparison *Performance varies based on airflow speed (LFM):* | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 6.27 | | 300 | 1.5 | 3.46 | | 500 | 2.5 | 2.69 | | 700 | 3.5 | 2.30 |