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  • ATS-15F-23-C2-R0

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    ## Electronic Specifications and Overview: ATS-15F-23-C2-R0 The **ATS-15F-23-C2-R0** is a high-performance **Aluminum Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is specifically part of the **maxiFLOW™** series, designed to provide high thermal performance in environments with constrained airflow. --- ### 1. Key Technical Specifications | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-15F-23-C2-R0 | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ | | **Fin Style** | maxiFLOW (Tapered Fin) | | **Thermal Resistance (Flowing Air)** | 12.01 °C/W @ 100 LFM | | **Thermal Resistance (Static Air)** | N/A (Designed for forced convection) | | **Dimensions (L x W x H)** | 60mm x 60mm x 9.5mm | --- ### 2. Physical Design Features * **maxiFLOW™ Fin Geometry:** The fins are tapered and spread out toward the top. This design increases the surface area while reducing the pressure drop, allowing more air to flow through the heat sink compared to standard straight-fin designs. * **pushPIN™ Attachment:** This model uses a plastic or brass push-pin mechanism combined with a compression spring. This ensures a secure fit and constant pressure on the electronic component (like a CPU, FPGA, or GPU), which improves heat transfer through the Thermal Interface Material (TIM). * **Blue Anodized Finish:** The surface is treated with a blue anodized coating, which provides corrosion resistance and increases emissivity for better radiative cooling. --- ### 3. Thermal Performance (Efficiency) The performance of this heat sink varies based on the velocity of the air passing through it (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 (0.5 m/s)** | 12.01 | | **200 (1.0 m/s)** | 8.34 | | **300 (1.5 m/s)** | 6.74 | | **400 (2.0 m/s)** | 5.78 | | **500 (2.5 m/s)** | 5.10 | --- ### 4. Components in the Kit When purchasing this part number, the package typically includes: 1. **The Heat Sink:** The aluminum body. 2. **Push-Pins:** Usually two or four pins (depending on the hole pattern). 3. **Springs:** Compression springs to maintain consistent pressure. 4. **Thermal Interface Material (TIM):** Pre-applied phase-change material or thermal grease on the base.
    ✨ Follow-up Questions
    • ⤷ What are the specific hole patterns required on the PCB for the pushPIN attachment?
    • ⤷ How does the maxiFLOW fin design compare to a standard pin fin heat sink in terms of weight?
    • ⤷ Can this heat sink be used with high-power FPGAs exceeding 50W?