### ATS-15F-24-C2-R0 Technical Overview The **ATS-15F-24-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is specifically designed for cooling electronic components such as BGA (Ball Grid Array) packages, CPUs, and GPUs in high-airflow environments. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Attachment Method** | Push-Pin (Plastic) | | **Material** | Aluminum (Blue Anodized Finish) | | **Thermal Resistance** | 2.36°C/W (at 200 LFM) | | **Shape** | Square | | **Weight** | ~35 Grams | --- ### 2. Design and Construction #### Fin Configuration This model utilizes a **Fine-Pitch** fin design. The fins are densely packed to provide a large surface area for heat dissipation without significantly increasing the footprint of the heat sink. #### Attachment Mechanism: pushPIN™ The "C2" in the part number refers to the specific attachment kit. * **Plastic Push-Pins:** These provide a secure, vibration-resistant mount to the PCB. * **Spring-Loaded:** The pins use a stainless steel spring to ensure consistent pressure between the heat sink and the component, optimizing thermal transfer. #### Thermal Interface Material (TIM) The "R0" suffix typically denotes that the heat sink comes with a **pre-applied phase-change material** or high-performance thermal pad on the base, reducing the need for manual thermal paste application. --- ### 3. Thermal Performance Metrics Thermal resistance indicates how efficiently the part moves heat away from the component. Effectiveness varies based on airflow (LFM - Linear Feet per Minute): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 (Unducted)** | 5.80 | | **200 (Unducted)** | 2.36 | | **400 (Unducted)** | 1.60 | | **600 (Unducted)** | 1.30 | --- ### 4. Dimensional Data * **Length/Width:** 45.00mm x 45.00mm * **Height:** 20.00mm * **Pitch (Hole-to-Hole):** 38.00mm --- ### Summary of Benefits 1. **High Reliability:** The push-pin system ensures the heat sink does not shift during shipping or operation. 2. **Optimized Airflow:** The fin geometry is designed for systems with active fan cooling. 3. **Ease of Assembly:** The integrated pins and pre-applied thermal material streamline the manufacturing process.