The **ATS-15F-28-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for efficient heat dissipation from integrated circuits (ICs) and other electronic components. --- ## 1. Technical Specifications The part number provides specific data regarding its dimensions, thermal resistance, and mounting style. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45mm x 45mm x 15mm | | **Fin Style** | Fine-Pitch (increases surface area) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | Approx. 10.57 °C/W (at 100 LFM) | --- ## 2. Key Component Breakdown ### A. The Heat Sink Body The body is constructed from **Aluminum 6063**, which is preferred in electronics for its high thermal conductivity and lightweight properties. The **Blue Anodized** finish is not just aesthetic; it provides a protective layer against corrosion and slightly improves radiant heat emissivity. ### B. pushPIN™ Attachment System Instead of using messy adhesives or thermal tape, this part uses a mechanical fastening system: * **Push Pins:** Made of brass or plastic, these lock into pre-drilled holes in the PCB. * **Compression Springs:** These provide a precise "Force-on-Component" to ensure the heat sink remains in constant contact with the chip, even during mechanical vibration. ### C. Thermal Interface Material (TIM) The **"R0"** suffix usually indicates that the heat sink comes with a pre-applied high-performance thermal interface material (like a thermal pad or phase-change material) on the base, ensuring there are no air gaps between the heat sink and the electronic chip. --- ## 3. Performance Metrics Thermal performance varies based on the airflow (Measured in Linear Feet per Minute - LFM): | Airflow Velocity | 100 LFM (0.5 m/s) | 300 LFM (1.5 m/s) | 500 LFM (2.5 m/s) | | :--- | :--- | :--- | :--- | | **Thermal Resistance** | 10.57 °C/W | 3.55 °C/W | 2.15 °C/W | --- ## 4. Typical Applications * **Networking Hardware:** Switches, routers, and modems. * **Processors:** Cooling CPUs, GPUs, or FPGAs in industrial computers. * **Power Electronics:** Voltage regulators and power modules that generate significant heat in a small footprint.