## Technical Overview: ATS-15F-31-C2-R0 The **ATS-15F-31-C2-R0** is a high-performance **heat sink** component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series, designed for cooling electronic components such as processors, FPGAs, and ASICs that generate significant heat during operation. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-15F-31-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Plastic/Brass) | | **Thermal Resistance** | 25.23°C/W (Unducted) | | **Dimensions (L x W x H)** | 54mm x 54mm x 10mm | | **Thermal Interface Material (TIM)** | T766 | --- ### 2. Design and Construction The "electronic parts" of this assembly are purely mechanical and thermal in nature. Here is the breakdown of the sub-components: #### A. The Heat Sink Body * **Geometry:** It features a **Straight Fin** design. This is optimized for airflow that moves linearly across the component. * **Material:** Extruded aluminum, which offers a high strength-to-weight ratio and excellent thermal conductivity. * **Surface Treatment:** The **Blue Anodized** finish is not just for aesthetics; it provides corrosion resistance and increases surface emissivity, slightly improving radiant heat transfer. #### B. The Attachment Mechanism (Push Pins) * The **"R0"** in the part number signifies the specific attachment kit. * It utilizes pre-assembled **Push Pins** and **Springs**. The springs ensure a consistent and precise downward pressure (force) on the electronic chip, which is critical for maximizing the efficiency of the thermal interface. #### C. Thermal Interface Material (TIM) * The unit comes with **T766** pre-applied to the base. * **Function:** This material fills the microscopic air gaps between the heat sink base and the electronic component (CPU/GPU), significantly reducing thermal resistance. --- ### 3. Thermal Performance Metrics Thermal performance varies based on the velocity of the air (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 (0.5 m/s)** | 25.23 | | **200 (1.0 m/s)** | 5.94 | | **400 (2.0 m/s)** | 2.81 | | **600 (3.0 m/s)** | 1.88 | --- ### 4. Typical Applications * **Telecommunications:** Cooling of networking switches and routers. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Supplies:** Heat dissipation for power transistors and MOSFETs.