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  • ATS-15F-38-C2-R0

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    The **ATS-15F-38-C2-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is part of their "maxiFLOW™" series, designed for cooling electronic components like CPUs, GPUs, or high-power transistors. --- ### ## Technical Specifications Below are the primary technical parameters for this specific part number: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Thermal Resistance** | 0.84 °C/W (at 200 LFM) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 40mm x 40mm x 35mm | | **Flow Pattern** | Spread Fin / Tapered | --- ### ### Key Electronic & Mechanical Features 1. **High-Efficiency Fin Design:** The "maxiFLOW" design features a tapered fin structure that maximizes surface area and increases air turbulence, significantly reducing thermal resistance compared to standard straight-fin heat sinks. 2. **pushPIN™ Attachment:** This part uses a specific mechanical fastening system. It includes pre-assembled hardware (springs and pins) that allows for secure mounting to the PCB without the need for tools, ensuring consistent pressure for optimal thermal interface material (TIM) performance. 3. **Blue Anodized Finish:** The surface treatment is not just aesthetic; it increases the surface emissivity, which aids in radiant heat transfer and protects the aluminum from corrosion. 4. **Thermal Interface Material (TIM):** Usually, these units come with a pre-applied high-performance thermal pad (often T766) to ensure the gap between the electronic component (heat source) and the sink is fully filled. --- ### ### Part Number Breakdown Understanding the nomenclature helps in identifying variants: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **15F:** Refers to the specific fin geometry and spacing. * **38:** Represents the footprint or specific size code. * **C2:** Refers to the thermal performance/material grade. * **R0:** Indicates the RoHS compliance and packaging revision. --- ### ### Applications This part is commonly used in: * **Networking Equipment:** Routers, switches, and base stations. * **Industrial PCs:** Where active fan cooling might be limited or requires high-reliability passive heat dissipation. * **Power Supplies:** Cooling MOSFETs and voltage regulators.
    ✨ Follow-up Questions
    • ⤷ What are the differences between the pushPIN and clip-on attachment methods for this series?
    • ⤷ How does the LFM (Linear Feet per Minute) affect the thermal resistance of the ATS-15F-38-C2-R0?
    • ⤷ Does this heat sink come with pre-applied thermal interface material (TIM)?