ATS-15F-38-C2-R0
AI

The **ATS-15F-38-C2-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is part of their "maxiFLOW™" series, designed for cooling electronic components like CPUs, GPUs, or high-power transistors.
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### ## Technical Specifications
Below are the primary technical parameters for this specific part number:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | maxiFLOW™ |
| **Thermal Resistance** | 0.84 °C/W (at 200 LFM) |
| **Material** | Aluminum (Blue Anodized) |
| **Attachment Method** | pushPIN™ |
| **Dimensions (L x W x H)** | 40mm x 40mm x 35mm |
| **Flow Pattern** | Spread Fin / Tapered |
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### ### Key Electronic & Mechanical Features
1. **High-Efficiency Fin Design:**
The "maxiFLOW" design features a tapered fin structure that maximizes surface area and increases air turbulence, significantly reducing thermal resistance compared to standard straight-fin heat sinks.
2. **pushPIN™ Attachment:**
This part uses a specific mechanical fastening system. It includes pre-assembled hardware (springs and pins) that allows for secure mounting to the PCB without the need for tools, ensuring consistent pressure for optimal thermal interface material (TIM) performance.
3. **Blue Anodized Finish:**
The surface treatment is not just aesthetic; it increases the surface emissivity, which aids in radiant heat transfer and protects the aluminum from corrosion.
4. **Thermal Interface Material (TIM):**
Usually, these units come with a pre-applied high-performance thermal pad (often T766) to ensure the gap between the electronic component (heat source) and the sink is fully filled.
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### ### Part Number Breakdown
Understanding the nomenclature helps in identifying variants:
* **ATS:** Manufacturer (Advanced Thermal Solutions).
* **15F:** Refers to the specific fin geometry and spacing.
* **38:** Represents the footprint or specific size code.
* **C2:** Refers to the thermal performance/material grade.
* **R0:** Indicates the RoHS compliance and packaging revision.
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### ### Applications
This part is commonly used in:
* **Networking Equipment:** Routers, switches, and base stations.
* **Industrial PCs:** Where active fan cooling might be limited or requires high-reliability passive heat dissipation.
* **Power Supplies:** Cooling MOSFETs and voltage regulators.
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What are the differences between the pushPIN and clip-on attachment methods for this series?
- ⤷ How does the LFM (Linear Feet per Minute) affect the thermal resistance of the ATS-15F-38-C2-R0?
- ⤷ Does this heat sink come with pre-applied thermal interface material (TIM)?