The **ATS-15F-46-C3-R0** is a specific electronic component primarily classified as a **High-Performance Heat Sink**. It is manufactured by *Advanced Thermal Solutions (ATS)* and belongs to the **blueICE™** series. Below is a detailed breakdown of its specifications and electronic/mechanical properties. --- ### 1. General Specifications | Feature | Description | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-15F-46-C3-R0 | | **Component Type** | Heat Sink | | **Attachment Method** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | --- ### 2. Physical Dimensions Precision in dimensions is critical for ensuring the heat sink fits within the PCB layout and clears surrounding electronic components. * **Length:** 25.00 mm * **Width:** 25.00 mm * **Height (Fin Depth):** 25.00 mm * **Pitch (Hole Spacing):** 30.00 mm --- ### 3. Thermal Performance Thermal resistance is the most important electronic factor, determining how efficiently heat is moved away from the semiconductor (CPU, GPU, or MOSFET). | Air Flow (LFM) | Velocity (m/s) | Thermal Resistance (Unducted) | | :--- | :--- | :--- | | 100 LFM | 0.5 m/s | 11.84 °C/W | | 300 LFM | 1.5 m/s | 5.53 °C/W | | 500 LFM | 2.5 m/s | 4.22 °C/W | | 700 LFM | 3.5 m/s | 3.61 °C/W | --- ### 4. Electronic & Mechanical Features #### A. pushPIN™ Attachment System This part uses a specialized **pushPIN™** system rather than adhesive tape. * **Springs:** Use a high-performance compression spring to ensure even pressure across the component interface. * **Reliability:** Unlike thermal tape, this mechanical fix prevents the heat sink from shifting due to vibration or high heat cycles. #### B. Fine Pitch Fin Design The "F" in the part number often denotes the fin density. This specific model uses a **Fine-Pitch** design, which provides a larger surface area for heat dissipation, making it suitable for environments with high airflow. #### C. Thermal Interface Material (TIM) * **Pre-applied:** This specific part number comes with **T412** thermal interface material. * **Function:** T412 is a high-efficiency phase-change material that fills microscopic air gaps between the component and the heat sink to maximize heat transfer. --- ### 5. Common Applications * **BGA Cooling:** Used for Ball Grid Array processors. * **Power Supplies:** Cooling voltage regulators. * **Telecommunications:** High-speed data processing chips that generate significant heat in a small footprint. ---