The **ATS-15F-72-C3-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Heat Sink** from the *maxiFLOW™* series. --- ### 1. Technical Specifications This part is designed for cooling high-power electronic components like FPGAs, CPUs, and GPUs. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Product Line** | maxiFLOW™ | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance (Flowing Air)** | 1.81°C/W @ 200 LFM | | **Thermal Resistance (Static Air)** | 5.07°C/W | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 35.00mm | --- ### 2. Key Components & Design Features #### A. Fin Geometry (maxiFLOW™) The "maxiFLOW" design uses a tapered fin structure. Unlike standard straight fins, these are designed to maximize surface area and increase air turbulence, which significantly improves heat dissipation efficiency in constrained spaces. #### B. pushPIN™ Attachment The **-R0** suffix indicates the inclusion of the pushPIN™ attachment system. This consists of: * **Compression Springs:** Provide precise pressure to ensure optimal thermal interface contact. * **Brass/Plastic Pins:** Secure the heat sink to the PCB through pre-drilled holes. #### C. Thermal Interface Material (TIM) Usually, these units come pre-applied with a high-performance thermal pad or phase-change material on the base to bridge the microscopic air gaps between the heat sink and the electronic chip. --- ### 3. Part Number Breakdown Understanding the nomenclature helps in identifying variants: | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Manufacturer) | | **15F** | Series/Specific Design Profile | | **72** | Specific Fin Configuration/Size Code | | **C3** | Thermal Performance/Material Class | | **R0** | Revision / Packaging / Attachment style | --- ### 4. Applications * **Telecommunications:** Cooling high-speed networking switches. * **Industrial PC:** Ruggedized systems requiring passive or assisted airflow cooling. * **Power Supplies:** Managing heat in DC-DC converters.