The **ATS-15F-76-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" family, designed for cooling integrated circuits (ICs) and other electronic components. --- ## 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Heat Sink Type** | Fine Pitch (Push-Pin) | | **Length (X)** | 25.00 mm | | **Width (Y)** | 25.00 mm | | **Height (Z)** | 10.00 mm | | **Attachment Type** | Push-Pin (Brass) | | **Thermal Resistance** | 27.60°C/W (Unducted Flow @ 100 LFM) | | **Thermal Interface** | T412 (Pre-applied) | --- ## 2. Key Electronic Features ### A. Material & Surface Treatment * **Aluminum 6063:** Provides high thermal conductivity for efficient heat dissipation. * **Blue Anodized Finish:** Protects the aluminum from corrosion and slightly increases emissivity, improving radiative heat transfer. ### B. Fin Design (Fine-Pitch) The "76" in the part number indicates a specific fin pattern. The **Fine-Pitch** design maximizes the surface area within a small footprint (25mm x 25mm), making it ideal for high-density PCB layouts where space is limited but cooling demands are high. ### C. Attachment Mechanism (Push-Pin) Unlike adhesive-based heat sinks, the **push-pin** system uses a flexible spring-loaded mechanism. * **Benefits:** Ensures constant pressure between the heat sink and the component, which optimizes thermal transfer. * **Reliability:** It is more secure than thermal tape in high-vibration environments (e.g., aerospace or industrial machinery). ### D. Thermal Interface Material (TIM) This model comes with **T412** pre-applied to the base. T412 is a high-performance thermal pad that fills microscopic air gaps between the chip and the heat sink, significantly lowering thermal impedance. --- ## 3. Comparison with Similar Models | Model Number | Height (Z) | Thermal Resistance (100 LFM) | | :--- | :--- | :--- | | **ATS-15F-76-C3-R0** | 10 mm | 27.60 °C/W | | **ATS-15F-77-C3-R0** | 15 mm | 17.50 °C/W | | **ATS-15F-78-C3-R0** | 20 mm | 14.30 °C/W | --- ## 4. Typical Applications * **Embedded Systems:** Cooling small CPUs or FPGAs. * **Telecommunications:** Transceiver modules and network switches. * **Power Supplies:** Managing heat in voltage regulators and MOSFETs.