The **ATS-15F-77-C3-R0** is a high-performance electronic thermal management component, specifically a **Pin Fin Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like BGA (Ball Grid Array) chips, FPGAs, and processors. --- ## 1. Technical Specifications The following table details the physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (with Springs) | | **Dimensions (L x W x H)** | 25.00mm x 25.00mm x 30.00mm | | **Thermal Resistance (Flowing)** | 9.58°C/W @ 100 LFM to 2.34°C/W @ 700 LFM | | **Thermal Resistance (Static)** | 1.87°C/W (Under high flow conditions) | | **Weight** | 33 grams | --- ## 2. Key Design Components ### A. Material and Coating * **Aluminum Body:** Provides a high thermal conductivity-to-weight ratio, ensuring efficient heat transfer from the heat source to the air. * **Blue Anodized Finish:** Not only provides corrosion resistance but also slightly increases surface emissivity for improved radiative cooling. ### B. Pin Fin Geometry Unlike traditional straight-fin heat sinks, the pin-fin design is effective in environments where the airflow direction is unpredictable or multi-directional. The pins break up the boundary layer of air, increasing turbulence and enhancing heat dissipation. ### C. Attachment Mechanism (pushPIN™) The part utilizes a specialized mounting system: * **Push Pins:** Plastic or brass pins that snap into pre-drilled holes on the PCB. * **Compression Springs:** These ensure a precise and consistent downward force (pressure) onto the component, optimizing the thermal interface material (TIM) performance. --- ## 3. Applications The ATS-15F-77-C3-R0 is typically used in space-constrained applications requiring high thermal performance, such as: 1. **Telecommunications:** Routers, switches, and base stations. 2. **Embedded Computing:** Industrial PC boards and compact servers. 3. **Power Electronics:** DC-DC converters and high-speed motor controllers. --- ## 4. Thermal Performance Comparison Thermal resistance is critical; the lower the °C/W value, the better the cooling: | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 9.58 | | 300 (1.5 m/s) | 3.69 | | 500 (2.5 m/s) | 2.67 | | 700 (3.5 m/s) | 2.34 |